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LAN7431-V/YXXVAO

Microchip Technology

LAN7431-V/YXXVAO by Microchip Technology

LAN7431-V/YXXVAO by Microchip Technology is a Serial Communication Controller with 256 MBps data transfer rate, suitable for SYNC, BYTE and ETHERNET protocols. Operating temperature ranges from -40 to 105 °C, with low power mode and PCI bus compatibility. Package style is CHIP CARRIER with 72 terminals in QUAD position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,238 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Ampacity Inc.

Singapore . 1,279 parts In-Stock

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$18.000

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1,279

$18.000

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Corohmni

South Africa . 317 parts In-Stock

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$54.007

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317

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 9,813 parts In-Stock

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Continental Prestige Electronics

USA . 4,882 parts In-Stock

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Argo Parts USA

USA . 4,200 parts In-Stock

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West Coast Incorporated

USA . 2,562 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your communication systems with the LAN7431-V/YXXVAO from Microchip Technology. Designed to meet the highest standards of quality and reliability, this Serial Communication Controller is a game-changer in the industry. With its cutting-edge technology and wide range of applications, this product offers unmatched value and benefits to customers seeking efficient data transfer rates and seamless connectivity. Trust Microchip Technology to deliver excellence in every aspect, providing you with the advantage you need for success in today's competitive market.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 1.32 V

Provides versatility in power supply options, accommodating a range of voltage inputs.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive industry standards ensures high reliability and quality performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the board, optimizing layout design.

No. of Terminals: 72

Higher number of terminals allow for more connectivity options and functions to be integrated.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles provide flexibility in mounting options and heat dissipation capabilities.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in reducing power consumption and enhancing efficiency.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures stable performance even in challenging environments.

Maximum Data Transfer Rate: 256 MBps

High data transfer rate allows for fast and efficient communication, ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables operation in extreme cold conditions without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and reliable contact for long-term use.

Terminal Position: QUAD

Quad terminal layout facilitates easy connection and integration into various circuit configurations.

Maximum Seated Height: 1 mm

Low seated height minimizes overall profile of the component, allowing for compact system designs.

Width: 10 mm

Standard width dimension ensures compatibility with common board layouts and spacing requirements.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and diagnosis of system faults for enhanced reliability.

Communication Protocol: SYNC, BYTE; ETHERNET

Support for multiple communication protocols enables versatile connectivity options for diverse applications.

Maximum Clock Frequency: 25 MHz

High clock frequency enables rapid data processing and real-time communication tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time ensures proper soldering and component bonding during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures component reliability during assembly.

Length: 10 mm

Compact length dimension allows for space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specific peripheral IC type enables seamless integration with serial communication devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces health hazards.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliability under a standard operating condition.

No. of Serial I/Os: 4

Multiple serial I/Os allow for simultaneous data transmission and reception, enhancing communication capabilities.

Bus Compatibility: PCI

PCI bus compatibility facilitates easy integration with a wide range of computer systems and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and interconnection with other components for efficient circuit design.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the component's resistance to moisture, ensuring reliability in humid environments.

Low Power Mode: YES

Inclusion of low power mode enhances energy efficiency and prolongs battery life in portable devices.

Technical Specifications

Serial Communication Controllers LAN7431-V/YXXVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

256 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

72

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LAN7431-V/YXXVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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