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TNETE110APGE

Texas Instruments

TNETE110APGE by Texas Instruments

TNETE110APGE by Texas Instruments is a Serial Communication Controller with 32-bit address bus width, 1.25 MBps data transfer rate, and 20 MHz clock frequency. It is used in LAN applications for PCI bus compatibility, featuring gull wing terminal form and CMOS technology.

Median Price

$14.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 122 parts In-Stock

1+ parts

-

100+ parts

$11.880

1k+ parts

$10.630

10k+ parts

$10.000

122

-

$11.880

$10.630

$10.000

DigiKey

USA . 122 parts In-Stock

1+ parts

-

100+ parts

$15.630

1k+ parts

-

10k+ parts

-

122

-

$15.630

-

-

Verical

USA . 122 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.287

10k+ parts

$12.500

122

-

$14.850

$13.287

$12.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,513 parts In-Stock

1+ parts

$12.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

$12.540

-

-

-

Vyrian

USA . 7,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,383

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$9.582

100+ parts

$8.720

1k+ parts

$7.857

10k+ parts

-

100

$9.582

$8.720

$7.857

-

Corphita

USA . 3,710 parts In-Stock

1+ parts

$11.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,710

$11.880

-

-

-

Parana Technologies

USA . 1,683 parts In-Stock

1+ parts

$18.381

100+ parts

-

1k+ parts

$18.507

10k+ parts

-

1,683

$18.381

-

$18.507

-

ChromeModa Solutions

Germany . 5,651 parts In-Stock

1+ parts

$20.653

100+ parts

$16.935

1k+ parts

-

10k+ parts

-

5,651

$20.653

$16.935

-

-

IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$20.653

100+ parts

$19.620

1k+ parts

$18.588

10k+ parts

-

2,115

$20.653

$19.620

$18.588

-

DigiPath Technology Company

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$18.621

1k+ parts

-

10k+ parts

-

25

-

$18.621

-

-

Overview

Discover the unparalleled quality and reliability of the TNETE110APGE by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a Serial Communication Controller, this product offers seamless connectivity and fast data transfer rates, making it ideal for a wide range of applications. With its advanced features and user-friendly design, customers can experience unmatched value and performance. Upgrade your systems today with the TNETE110APGE and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to damage, making the product suitable for a variety of environments.

Maximum Supply Voltage: 5.25 V

Offers a high level of voltage tolerance, allowing for flexibility in power supply options.

Maximum Data Transfer Rate: 1.25 MBps

High data transfer rate enables efficient and fast communication between devices.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Designed for serial communication and LAN connectivity, making it a versatile choice for networking applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Serial Communication Controllers TNETE110APGE attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

20 MHz

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

1

No. of I/O Lines:

0

No. of Serial I/Os:

2

No. of Terminals:

144

On Chip Data RAM Width:

0

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Trade Compliance

TNETE110APGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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