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TNETE100PMPGE

Texas Instruments

TNETE100PMPGE by Texas Instruments

TNETE100PMPGE by Texas Instruments is a Serial Communication Controller with 32-bit address bus width, 1.25 MBps data transfer rate, and 33 MHz clock frequency. Ideal for LAN applications, it features low power mode, quad terminal position, and gull wing terminal form in a flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,976 parts In-Stock

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5,976

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Digiode

USA . 4,187 parts In-Stock

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4,187

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Bristol Electronics

USA . 527 parts In-Stock

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527

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PC Components Company LLC

USA . 129 parts In-Stock

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129

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Q Components

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$13.536

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646

$13.536

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Parana Technologies

USA . 2,341 parts In-Stock

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$15.052

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$15.467

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2,341

$15.052

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$15.467

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ChromeModa Solutions

Germany . 4,462 parts In-Stock

1+ parts

$16.912

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$13.868

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4,462

$16.912

$13.868

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IDEA Electronic Components Group

UK . 1,414 parts In-Stock

1+ parts

$16.912

100+ parts

$16.066

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$15.221

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1,414

$16.912

$16.066

$15.221

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One Stop Electronics

USA . 130 parts In-Stock

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$25.000

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130

$25.000

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DigiPath Technology Company

USA . 791 parts In-Stock

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$15.248

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791

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$15.248

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Corphita

USA . 591 parts In-Stock

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591

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Overview

Experience seamless and reliable communication with the TNETE100PMPGE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Serial Communication Controllers that are perfect for a wide range of applications. With a maximum data transfer rate of 1.25 MBps and low power mode capability, this product offers unmatched value and benefits to customers seeking efficient and high-performance solutions. Trust Texas Instruments to provide you with cutting-edge technology that meets your communication needs effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 144

The large number of terminals provides ample connectivity options for interfacing with other components in a system.

Maximum Data Transfer Rate: 1.25 MBps

The high data transfer rate enables fast and efficient communication between devices, making the product suitable for high-speed applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The inclusion of serial IO and LAN functionality expands the versatility and connectivity options of the product, making it a versatile solution for communication tasks.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency supports swift data processing and communication, ensuring smooth operation in time-critical applications.

Technical Specifications

Serial Communication Controllers TNETE100PMPGE attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33 MHz

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of Serial I/Os:

4

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Trade Compliance

TNETE100PMPGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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