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TNETC2040PPM

Texas Instruments

TNETC2040PPM by Texas Instruments

TNETC2040PPM by Texas Instruments is a Serial Communication Controller with 32-bit address bus width, operating at 33 MHz clock frequency. It supports SYNC, HDLC, X.25 protocols and has 4 serial I/Os for PCI bus compatibility. Ideal for industrial applications requiring high-speed data transfer up to 0.256 MBps in a compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,719 parts In-Stock

1+ parts

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8,719

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Digiode

USA . 3,246 parts In-Stock

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3,246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 224 parts In-Stock

1+ parts

$8.000

100+ parts

-

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224

$8.000

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AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$15.372

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228

$15.372

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Parana Technologies

USA . 915 parts In-Stock

1+ parts

$69.448

100+ parts

$6,449.262

1k+ parts

$62.503

10k+ parts

-

915

$69.448

$6,449.262

$62.503

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DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

$76.470

100+ parts

$70.353

1k+ parts

-

10k+ parts

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1,332

$76.470

$70.353

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ChromeModa Solutions

Germany . 2,598 parts In-Stock

1+ parts

$78.031

100+ parts

$63.985

1k+ parts

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2,598

$78.031

$63.985

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IDEA Electronic Components Group

UK . 2,211 parts In-Stock

1+ parts

$78.031

100+ parts

$74.129

1k+ parts

$70.228

10k+ parts

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2,211

$78.031

$74.129

$70.228

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Corphita

USA . 4,720 parts In-Stock

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4,720

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Overview

Unleash the power of seamless communication with the TNETC2040PPM by Texas Instruments. Designed with precision and quality in mind, this Serial Communication Controller offers unparalleled reliability and performance. Whether you're looking to enhance networking capabilities or streamline data transfer processes, this product is the perfect solution. With a wide range of applications and ease of integration, the TNETC2040PPM provides exceptional value and benefits to customers seeking efficient and dependable communication solutions. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, offering flexibility in power source selection.

Address Bus Width: 32

Wide address bus width supports efficient data transfer and communication.

Maximum Data Transfer Rate: 0.256 MBps

High data transfer rate ensures fast and efficient communication between devices.

Communication Protocol: SYNC, HDLC; X.25; LAPB; LAPD

Support for multiple communication protocols allows compatibility with various devices and systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Serial Communication Controllers TNETC2040PPM attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5 TO 5.5 VOLTS

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Communication Protocol:

SYNC, HDLC; X.25; LAPB; LAPD

Maximum Data Transfer Rate:

.256 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

Low Power Mode:

NO

No. of Serial I/Os:

4

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Trade Compliance

TNETC2040PPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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