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TNETE100APGE

Texas Instruments

TNETE100APGE by Texas Instruments

TNETE100APGE by Texas Instruments is a Serial Communication Controller with 32-bit Address Bus Width, 12.5 MBps Data Transfer Rate, and 33 MHz Max Clock Frequency. It is used in LAN applications for PCI bus compatibility, featuring GULL WING terminal form and NRZ data encoding method.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,800 parts In-Stock

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4,800

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Digiode

USA . 2,714 parts In-Stock

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2,714

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Eagle Technology Solutions

USA . 600 parts In-Stock

1+ parts

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600

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Bristol Electronics

USA . 8 parts In-Stock

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8

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Resion

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$5.731

100+ parts

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664

$5.731

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One Stop Electronics

USA . 1,209 parts In-Stock

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$7.000

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1,209

$7.000

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$63.026

100+ parts

$5,852.942

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$56.724

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786

$63.026

$5,852.942

$56.724

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DigiPath Technology Company

USA . 2,269 parts In-Stock

1+ parts

$69.400

100+ parts

$63.848

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2,269

$69.400

$63.848

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ChromeModa Solutions

Germany . 5,553 parts In-Stock

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$70.816

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$58.069

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5,553

$70.816

$58.069

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IDEA Electronic Components Group

UK . 1,582 parts In-Stock

1+ parts

$70.816

100+ parts

$67.275

1k+ parts

$63.734

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1,582

$70.816

$67.275

$63.734

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 1,596 parts In-Stock

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1,596

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Corphita

USA . 775 parts In-Stock

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775

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Overview

Upgrade your serial communication capabilities with the TNETE100APGE by Texas Instruments. Manufactured with precision and expertise, this Serial Communication Controller offers unmatched quality and reliability. Ideal for a wide range of applications, this product provides seamless data transfer at an impressive rate of 12.5 MBps. With a compact design and multiple power supply options, the TNETE100APGE is perfect for high-performance systems requiring fast and efficient communication. Trust Texas Instruments to deliver cutting-edge technology that brings value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 5.25 V

Supports a high maximum supply voltage, providing flexibility in power options.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient data handling and processing.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCBs.

Power Supplies (V): 3/5,5

Supports multiple power supply options for compatibility with various systems.

No. of Terminals: 144

With a large number of terminals, this product can support complex input and output connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style enhances thermal performance and allows for close component placement.

Minimum Supply Voltage: 3 V

Supports a low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate allows for fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without any issues.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection during installation.

Maximum Seated Height: 1.6 mm

Low seated height helps in compact designs and reduces the overall height of the system.

Width: 20 mm

Compact width size allows for space-saving integration in electronic systems.

Boundary Scan: YES

Boundary scan feature helps in testing and diagnosing connection and assembly issues.

Data Encoding or Decoding Method: NRZ

Non-Return-to-Zero encoding method ensures accurate data transmission.

External Data Bus Width: 32

Wide external data bus width of 32 facilitates high-speed data transfer.

Maximum Clock Frequency: 33 MHz

High maximum clock frequency enables rapid data processing and communication.

Length: 20 mm

Compact length size helps in optimizing space usage on PCBs.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

This peripheral IC type provides serial communication capabilities and LAN connectivity, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering and reliable connection on PCBs.

Maximum Supply Current: 285 mA

Supports a maximum supply current of 285 mA for stable and consistent power delivery.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V ensures compatibility with standard power sources.

No. of Serial I/Os: 3

Multiple serial I/Os offer connectivity options for interfacing with different devices.

Bus Compatibility: PCI

PCI bus compatibility allows for easy integration with existing systems and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and compact layout design.

Technical Specifications

Serial Communication Controllers TNETE100APGE attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

1

No. of I/O Lines:

0

No. of Serial I/Os:

3

No. of Terminals:

144

On Chip Data RAM Width:

0

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

285 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Trade Compliance

TNETE100APGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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