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TNETX3100PGW

Texas Instruments

TNETX3100PGW by Texas Instruments

TNETX3100PGW by Texas Instruments is a Serial Communication Controller with 25 MBps data transfer rate, 50 MHz clock frequency, and 10 serial I/Os. It is used in LAN applications for high-speed communication, featuring CMOS technology and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,947 parts In-Stock

1+ parts

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4,947

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Vyrian

USA . 3,584 parts In-Stock

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3,584

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,414 parts In-Stock

1+ parts

$11.000

100+ parts

-

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1,414

$11.000

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$17.653

100+ parts

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596

$17.653

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Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

$76.940

100+ parts

$7,145.010

1k+ parts

$69.246

10k+ parts

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1,506

$76.940

$7,145.010

$69.246

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DigiPath Technology Company

USA . 1,263 parts In-Stock

1+ parts

$84.720

100+ parts

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1,263

$84.720

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

1+ parts

$86.449

100+ parts

$82.127

1k+ parts

$77.804

10k+ parts

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2,128

$86.449

$82.127

$77.804

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ChromeModa Solutions

Germany . 1,362 parts In-Stock

1+ parts

$86.449

100+ parts

$70.888

1k+ parts

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1,362

$86.449

$70.888

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Corphita

USA . 224 parts In-Stock

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224

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Overview

Elevate your communication capabilities with the TNETX3100PGW by Texas Instruments. This cutting-edge Serial Communication Controller boasts premium quality and reliability, reflecting the excellence of its renowned manufacturer. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking seamless data transfer and high-speed performance. Experience enhanced connectivity and efficiency with the TNETX3100PGW, setting new standards in serial IO/communication controllers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable or rugged applications.

Surface Mount: YES

Allows for easy integrated circuit board assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Address Bus Width: 2

Supports multiple address locations, enabling efficient communication with other devices.

Package Shape: SQUARE

Square shape simplifies PCB layout and assembly, optimizing space utilization.

No. of Terminals: 240

Provides a sufficient number of connection points for various I/O and communication requirements.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG

Enhanced thermal management with heat sink/slug style, ensuring reliable operation in demanding environments.

Minimum Supply Voltage: 3 V

Can operate at lower voltages for power efficiency and compatibility with different systems.

Maximum Operating Temperature: 95 °C

Capable of operating in high-temperature environments without performance degradation.

Maximum Data Transfer Rate: 25 MBps

High data transfer rate supports fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Can function at low temperatures, suitable for a wide range of operating conditions.

Terminal Position: QUAD

Quad terminal arrangement simplifies connection and integration with other components.

Boundary Scan: YES

Boundary scan capability aids in debugging and testing during product development and maintenance.

External Data Bus Width: 8

Supports wider data bus for increased data transfer efficiency and compatibility with external devices.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for faster data processing and communication speed.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Designed for serial and LAN communication tasks, adding versatility to the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering during assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal voltage ensures consistent performance and compatibility with various systems.

No. of Serial I/Os: 10

Ample serial I/O ports allow for multiple communication channels and device connectivity.

Technical Specifications

Serial Communication Controllers TNETX3100PGW attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

2

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

25 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G240

Low Power Mode:

NO

No. of Serial I/Os:

10

No. of Terminals:

240

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TNETX3100PGW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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