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TNETX3151PGV

Texas Instruments

TNETX3151PGV by Texas Instruments

TNETX3151PGV by Texas Instruments is a Serial Communication Controller with 2.3-2.7 V supply voltage range, 12.5 MBps data transfer rate, and 83.33 MHz clock frequency. Ideal for LAN applications, it features 15 serial I/Os and supports boundary scan technology in a compact square package design.

Median Price

$42.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28 parts In-Stock

1+ parts

$42.120

100+ parts

$41.280

1k+ parts

$40.440

10k+ parts

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28

$42.120

$41.280

$40.440

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Distributors (In-Stock)

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Vyrian

USA . 2,997 parts In-Stock

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2,997

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Resion

USA . 592 parts In-Stock

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592

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Odintec Ltd.

Israel . 11 parts In-Stock

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11

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Distributors (Availability)

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Andel Nordic

Denmark . 552 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

$9.101

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$9.101

552

$9.480

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$9.101

$9.101

AZTECH Wire

Italy . 694 parts In-Stock

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$10.168

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694

$10.168

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One Stop Electronics

USA . 1,036 parts In-Stock

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$23.000

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1,036

$23.000

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Parana Technologies

USA . 1,223 parts In-Stock

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$35.779

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1,223

$35.779

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DigiPath Technology Company

USA . 452 parts In-Stock

1+ parts

$39.397

100+ parts

$36.245

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452

$39.397

$36.245

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ChromeModa Solutions

Germany . 5,709 parts In-Stock

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$40.201

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$32.965

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5,709

$40.201

$32.965

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IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$40.201

100+ parts

$38.191

1k+ parts

$36.181

10k+ parts

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2,260

$40.201

$38.191

$36.181

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A-Z Elektronik GmbH

Germany . 6,789 parts In-Stock

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Lixinc

USA . 5,431 parts In-Stock

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Corphita

USA . 3,389 parts In-Stock

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Kepictronics

USA . 48 parts In-Stock

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48

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Cyclops Electronics Ltd (Excess)

UK . 13 parts In-Stock

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Overview

Elevate your communication capabilities with the TNETX3151PGV by Texas Instruments, a high-quality Serial Communication Controller that offers unparalleled performance and reliability. Manufactured by the trusted brand Texas Instruments, this product is designed to meet the demands of various applications in the industry. With its innovative technology and advanced features, the TNETX3151PGV provides customers with a seamless and efficient communication solution. Experience the value and benefits of this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 2.7 V

Operates efficiently within a low voltage range, making it suitable for power-constrained applications.

Address Bus Width: 2

Having a 2-bit address bus allows for simple and efficient communication with other devices in the system.

No. of Terminals: 240

Provides ample connectivity options for interfacing with various external components and peripherals.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate enables fast and efficient communication, ideal for high-speed data transmission requirements.

Maximum Clock Frequency: 83.33 MHz

High clock frequency ensures rapid processing and handling of data, enhancing overall performance.

Technical Specifications

Serial Communication Controllers TNETX3151PGV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

2

Boundary Scan:

YES

Maximum Clock Frequency:

83.33 MHz

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G240

Length:

32 mm

Low Power Mode:

NO

No. of Serial I/Os:

15

No. of Terminals:

240

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

32 mm

Trade Compliance

TNETX3151PGV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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