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MCP2515T-I/STG

Microchip Technology

MCP2515T-I/STG by Microchip Technology

MCP2515T-I/STG by Microchip: Serial Communication Controller with 5.5V max supply, 0.125 MBps data rate, and 40 MHz clock freq. Ideal for industrial applications requiring SPI bus compatibility and low power mode operation at -40 to 85 °C.

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,538 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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65

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AZTECH Wire

Italy . 554 parts In-Stock

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$19.459

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Ampacity Inc.

Singapore . 402 parts In-Stock

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$26.000

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Aztec Data Supply Inc.

USA . 4,773 parts In-Stock

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$26.360

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Semicontronic

India . 957 parts In-Stock

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$30.225

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$30.070

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Advanced Electronics

New Zealand . 28 parts In-Stock

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$38.071

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$36.167

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$36.167

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Corohmni

South Africa . 7 parts In-Stock

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$40.434

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Fulton Briggs Corp.

USA . 8,293 parts In-Stock

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Argo Parts USA

USA . 2,775 parts In-Stock

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Continental Prestige Electronics

USA . 1,835 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Unlock seamless communication with the MCP2515T-I/STG by Microchip Technology. As a trusted leader in serial communication controllers, Microchip Technology delivers top-tier quality and reliability. This product is designed to streamline data transfer at a maximum rate of 0.125 MBps, making it ideal for applications requiring fast and efficient communication. With a low power mode, industrial temperature grade, and SPI bus compatibility, the MCP2515T-I/STG offers unparalleled value and performance for your connectivity needs. Experience the benefits of cutting-edge technology with Microchip Technology's MCP2515T-I/STG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making it ideal for portable applications.

Surface Mount: YES

This product is surface mountable, allowing for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this controller is compatible with a wide range of power sources.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability, making this product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package offers easy integration into circuit designs and PCB layouts.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components in the system.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style helps save space on the PCB, making it ideal for applications with size constraints.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for operation in low power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and excellent solderability for reliable connections.

Terminal Position: DUAL

The dual terminal position layout offers increased flexibility in PCB routing and design.

Maximum Seated Height: 1.2 mm

The low profile of the seated height helps reduce overall system height, making it suitable for compact designs.

Width: 4.4 mm

The slim width of the controller allows for dense packing on the PCB, conserving board space.

Data Encoding or Decoding Method: NRZ

The NRZ encoding method simplifies data transmission and reception, ensuring accuracy.

Communication Protocol: SYNC; BIT; BYTE

The support for multiple communication protocols enables compatibility with various systems and devices.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for fast data processing and communication speed.

Length: 6.5 mm

The compact length of the controller contributes to overall space-saving on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this controller suitable for rugged applications and harsh environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type indicates the controller's ability to handle serial communication tasks efficiently.

Technology: CMOS

The CMOS technology used in this controller ensures low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and secure PCB mounting during assembly.

Maximum Supply Current: 10 mA

The low maximum supply current requirement helps minimize power consumption, making it energy-efficient.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many systems, ensuring compatibility.

Bus Compatibility: SPI

The SPI bus compatibility enhances the controller's versatility and ease of integration into various systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the PCB, maximizing board space utilization.

Low Power Mode: YES

The low power mode feature helps conserve energy and prolong battery life in power-sensitive applications.

Technical Specifications

Serial Communication Controllers MCP2515T-I/STG attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MCP2515T-I/STG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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