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TNETX4090GGP

Texas Instruments

TNETX4090GGP by Texas Instruments

TNETX4090GGP by Texas Instruments is a Serial Communication Controller with 250 MBps data transfer rate, suitable for LAN applications. It operates b/w 0-95 °C and has a supply voltage range of 2.25-2.7 V, featuring a grid array package style with 352 terminals.

Median Price

$150.265

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 12 parts In-Stock

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$150.000

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12

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American Microsemiconductor Inc.

USA . 92 parts In-Stock

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$150.530

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Vyrian

USA . 2,600 parts In-Stock

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2,600

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Digiode

USA . 1,010 parts In-Stock

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Microfarads

USA . 12 parts In-Stock

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Semi Source

USA . 1 parts In-Stock

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Electronics Depot

USA . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 353 parts In-Stock

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$17.000

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353

$17.000

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AZTECH Wire

Italy . 834 parts In-Stock

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$19.636

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834

$19.636

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Parana Technologies

USA . 838 parts In-Stock

1+ parts

$36.409

100+ parts

$3,381.129

1k+ parts

$32.768

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838

$36.409

$3,381.129

$32.768

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DigiPath Technology Company

USA . 1,669 parts In-Stock

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$40.091

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1,669

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ChromeModa Solutions

Germany . 4,708 parts In-Stock

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$40.909

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$33.545

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IDEA Electronic Components Group

UK . 264 parts In-Stock

1+ parts

$40.909

100+ parts

$38.864

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$36.818

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264

$40.909

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$36.818

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Corphita

USA . 4,245 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge communication technology with the TNETX4090GGP by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch Serial Communication Controllers that are versatile and reliable. This product opens up a world of possibilities for applications ranging from LAN to serial IO, offering lightning-fast data transfer rates of up to 250 MBps. Experience seamless connectivity and superior performance with the TNETX4090GGP, where quality meets innovation to enhance your projects like never before. Unlock the potential of your designs with this game-changing solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.7 V

Provides a wide range of operating voltages, offering flexibility in different power supply setups.

Address Bus Width: 2

Offers efficient data communication capabilities for addressing memory locations.

Package Shape: SQUARE

Square shape allows for uniform placement on circuit boards, optimizing space usage.

No. of Terminals: 352

High number of terminals enable connectivity to various components, enhancing functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

Combination of grid array and heat sink design helps in efficient heat dissipation and space-saving.

Minimum Supply Voltage: 2.25 V

Allows for operation at lower voltages, increasing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 95 °C

High operating temperature range provides reliability and performance in various environments.

Maximum Data Transfer Rate: 250 MBps

High data transfer rate ensures fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Wide temperature range ensures product reliability in both low and high-temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and connection on circuit boards.

Maximum Seated Height: 1.7 mm

Low profile design reduces overall height, making it suitable for compact electronic devices.

Width: 35 mm

Compact width allows for easy integration into various electronic systems.

External Data Bus Width: 8

Wide external data bus width enables high-speed data transfer and efficient processing.

Length: 35 mm

Compact length ensures space-saving and easy placement on circuit boards.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Supports various peripherals and communication protocols, enhancing connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable data transmission.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage provides consistent performance and reliable operation.

No. of Serial I/Os: 9

Multiple serial I/O ports offer versatile connectivity options for various devices.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for compact design and efficient routing of connections.

Technical Specifications

Serial Communication Controllers TNETX4090GGP attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 TO 3.6 VOLTS

Address Bus Width:

2

Boundary Scan:

NO

Maximum Data Transfer Rate:

250 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

NO

No. of Serial I/Os:

9

No. of Terminals:

352

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

35 mm

Trade Compliance

TNETX4090GGP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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