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TNETX3190PGV

Texas Instruments

TNETX3190PGV by Texas Instruments

TNETX3190PGV by Texas Instruments is a Serial Communication Controller with 75 MBps data transfer rate, 83.33 MHz clock frequency, and 19 serial I/Os. Ideal for LAN applications, this CMOS technology-based controller operates b/w 0-95°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,791 parts In-Stock

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Digiode

USA . 1,542 parts In-Stock

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Legend Electronics Inc.

USA . 153 parts In-Stock

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Q Components

USA . 74 parts In-Stock

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AZTECH Wire

Italy . 395 parts In-Stock

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$7.373

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Ampacity Inc.

Singapore . 416 parts In-Stock

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$31.000

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One Stop Electronics

USA . 1,391 parts In-Stock

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Parana Technologies

USA . 1,201 parts In-Stock

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DigiPath Technology Company

USA . 1,836 parts In-Stock

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$58.659

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ChromeModa Solutions

Germany . 3,994 parts In-Stock

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$59.856

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$49.082

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

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$53.870

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Corphita

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Overview

Enhance your communication systems with the TNETX3190PGV by Texas Instruments. Designed with precision and quality in mind, this serial communication controller offers seamless integration and reliable performance. Whether you're looking to improve data transfer rates or enhance connectivity, this product delivers on all fronts. With Texas Instruments' reputation for excellence, you can trust that you're getting a top-of-the-line solution for your communication needs. Upgrade your systems today and experience the difference with the TNETX3190PGV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy installation onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 2.7 V

The maximum supply voltage of 2.7 V provides flexibility in power input options while ensuring safe operating conditions.

Address Bus Width: 2

With a wider address bus width of 2, the product can efficiently handle data transfer and processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB and simplifies board layout design.

No. of Terminals: 240

Having 240 terminals enables connection to various external components and peripherals for expanded functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, FINE PITCH

The variety of package styles available offers versatility in mounting and heat dissipation options for different application requirements.

Minimum Supply Voltage: 2.3 V

The minimum supply voltage of 2.3 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C allows for use in extended temperature environments without risking performance.

Maximum Data Transfer Rate: 75 MBps

The high maximum data transfer rate of 75 MBps enables fast and efficient communication with other devices for seamless data exchange.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position provides a balanced and secure connection interface for stable operation.

Maximum Seated Height: 4.2 mm

The maximum seated height of 4.2 mm allows for compact integration within electronic devices without compromising on performance.

Width: 32 mm

The width of 32 mm offers a compact form factor for easy placement and routing on the PCB.

Boundary Scan: YES

The presence of boundary scan capability enables efficient testing and troubleshooting of the device during manufacturing and maintenance.

External Data Bus Width: 8

The external data bus width of 8 enhances data processing capabilities and facilitates rapid data exchange with external devices.

Maximum Clock Frequency: 83.33 MHz

The high maximum clock frequency of 83.33 MHz allows for fast data processing and communication speeds, improving overall performance.

Length: 32 mm

The length of 32 mm complements the width and seated height for a well-balanced and compact design.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The peripheral IC type of serial IO/communication controller, LAN enables seamless integration and communication within a networked environment.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high reliability, making the product energy-efficient and durable.

Terminal Form: GULL WING

The gull wing terminal form offers robust and reliable connections suitable for various mounting and soldering techniques.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a balanced power input for stable and efficient operation.

No. of Serial I/Os: 19

Having 19 serial I/Os allows for versatile connectivity options with other devices and peripherals for enhanced functionality.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm offers precise and compact terminal placement, ensuring reliable connections within a limited space.

Technical Specifications

Serial Communication Controllers TNETX3190PGV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

2

Boundary Scan:

YES

Maximum Clock Frequency:

83.33 MHz

Maximum Data Transfer Rate:

75 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G240

Length:

32 mm

Low Power Mode:

NO

No. of Serial I/Os:

19

No. of Terminals:

240

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

32 mm

Trade Compliance

TNETX3190PGV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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