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TL16C550DRHBR

Texas Instruments

TL16C550DRHBR by Texas Instruments

TL16C550DRHBR by Texas Instruments is a Serial Communication Controller with 32 terminals, operating at 24 MHz clock frequency. It supports communication protocols like ASYNC and BIT, with a data transfer rate of 0.1875 MBps. Ideal for applications requiring high-speed serial data transmission in commercial-grade environments.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,496 parts In-Stock

1+ parts

$2.911

100+ parts

$2.551

1k+ parts

$1.441

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28,496

$2.911

$2.551

$1.441

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Rochester

USA . 2,616 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

2,616

-

$2.190

$1.960

$1.850

DigiKey

USA . 2,616 parts In-Stock

1+ parts

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$2.890

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2,616

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$2.890

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Verical

USA . 2,616 parts In-Stock

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-

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$2.450

10k+ parts

$2.313

2,616

-

-

$2.450

$2.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 842 parts In-Stock

1+ parts

$1.900

100+ parts

-

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842

$1.900

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Vyrian

USA . 2,836 parts In-Stock

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$2.000

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2,836

$2.000

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DigiKey Marketplace

USA . 2,616 parts In-Stock

1+ parts

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2,616

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Chip Stock

USA . 1,125 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,167 parts In-Stock

1+ parts

$1.800

100+ parts

-

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1,167

$1.800

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Parana Technologies

USA . 271 parts In-Stock

1+ parts

$52.724

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271

$52.724

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IDEA Electronic Components Group

UK . 1,293 parts In-Stock

1+ parts

$59.240

100+ parts

$56.278

1k+ parts

$53.316

10k+ parts

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1,293

$59.240

$56.278

$53.316

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ChromeModa Solutions

Germany . 1,186 parts In-Stock

1+ parts

$59.240

100+ parts

$48.577

1k+ parts

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1,186

$59.240

$48.577

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A-Z Elektronik GmbH

Germany . 6,054 parts In-Stock

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6,054

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Kepictronics

USA . 2,878 parts In-Stock

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2,878

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DigiPath Technology Company

USA . 1,774 parts In-Stock

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$53.411

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1,774

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$53.411

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock seamless communication with the TL16C550DRHBR by Texas Instruments - a superior choice for serial communication controllers. Crafted with quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. From industrial automation to telecommunications, this versatile component caters to a wide range of applications. Experience the value of faster data transfer rates, efficient power management, and precise terminal positioning. Elevate your projects with the TL16C550DRHBR and stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount capability allows for easy integration and assembly of the product onto circuit boards, making it suitable for modern electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, increasing flexibility in usage.

Address Bus Width: 3

The address bus width of 3 allows for efficient and precise communication between components, enhancing overall performance.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size constraints are a concern.

Power Supplies (V): 2.5/5

The product supports multiple power supply voltages (2.5V and 5V), giving users flexibility in power options and compatibility with various systems.

No. of Terminals: 32

With 32 terminals, the product enables versatile connectivity options and integration with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles (chip carrier, heat sink/slug, very thin profile) offer flexibility in mounting and thermal management, catering to diverse application requirements.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation even with lower power sources, enhancing reliability in various voltage conditions.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand elevated temperatures and operates reliably in demanding environments.

Maximum Data Transfer Rate: 0.1875 MBps

The high maximum data transfer rate of 0.1875 MBps ensures rapid and efficient data communication, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the product to function reliably in low-temperature environments, suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, resulting in reliable electrical connections.

Terminal Position: QUAD

The quad terminal position allows for easy installation and connectivity with other components, simplifying the integration process.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm contributes to a compact and slim profile, ideal for space-constrained applications.

Width: 5 mm

The width of 5mm offers a compact form factor, making the product suitable for applications where space is limited.

External Data Bus Width: 8

An external data bus width of 8 enhances data transfer efficiency, enabling quick and reliable communication between the product and external devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer allows for versatile and reliable data exchange, ensuring compatibility with various systems.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables fast data processing and communication, enhancing overall system performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product is suitable for reflow soldering processes, ensuring secure and reliable solder joints.

Length: 5 mm

The length of 5mm contributes to a compact and space-saving design, making the product suitable for applications with limited space availability.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets standard operating temperature requirements for commercial applications, offering reliability and consistency.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The product's peripheral IC type as a serial IO/communication controller offers advanced serial communication capabilities, making it a versatile solution for various applications.

Technology: CMOS

The CMOS technology used in the product results in low power consumption, high noise immunity, and reliable performance, making it an energy-efficient and robust solution.

Terminal Form: NO LEAD

The no-lead terminal form ensures environmental friendliness and compliance with lead-free regulations, making the product an eco-friendly choice.

Maximum Supply Current: 8 mA

The low maximum supply current of 8mA indicates efficient power consumption, contributing to energy savings and prolonged battery life in portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a standard power level for reliable and consistent operation across different systems and applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs, enabling space-efficient integration in electronic devices.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the product has a moderate sensitivity to moisture, suitable for standard handling and processing during assembly.

Technical Specifications

Serial Communication Controllers TL16C550DRHBR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TL16C550DRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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