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TL16C451FNR

Texas Instruments

TL16C451FNR by Texas Instruments

TL16C451FNR by Texas Instruments is a Serial Communication Controller with 5V power supply, 0-70°C operating temp, and 0.03125 MBps data transfer rate. It is used in IBM PC-AT systems for asynchronous communication at 5.71 MHz clock frequency.

Median Price

$9.450

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 148 parts In-Stock

1+ parts

$9.450

100+ parts

$6.262

1k+ parts

$8.798

10k+ parts

-

148

$9.450

$6.262

$8.798

-

Rochester

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

$8.030

1k+ parts

$7.180

10k+ parts

$6.760

20,000

-

$8.030

$7.180

$6.760

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$10.037

1k+ parts

$8.975

10k+ parts

$8.450

12,500

-

$10.037

$8.975

$8.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,960 parts In-Stock

1+ parts

$6.128

100+ parts

-

1k+ parts

-

10k+ parts

-

4,960

$6.128

-

-

-

Vyrian

USA . 4,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,562

-

-

-

-

Resion

USA . 922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

922

-

-

-

-

MISTER SPROCKETS

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,664 parts In-Stock

1+ parts

$5.805

100+ parts

-

1k+ parts

-

10k+ parts

-

2,664

$5.805

-

-

-

Parana Technologies

USA . 742 parts In-Stock

1+ parts

$27.340

100+ parts

-

1k+ parts

$34.763

10k+ parts

-

742

$27.340

-

$34.763

-

ChromeModa Solutions

Germany . 4,685 parts In-Stock

1+ parts

$30.719

100+ parts

$25.190

1k+ parts

-

10k+ parts

-

4,685

$30.719

$25.190

-

-

IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$30.719

100+ parts

$29.183

1k+ parts

$27.647

10k+ parts

-

1,786

$30.719

$29.183

$27.647

-

Microchip USA

USA . 2,705 parts In-Stock

1+ parts

$160.260

100+ parts

$157.470

1k+ parts

$156.080

10k+ parts

$154.680

2,705

$160.260

$157.470

$156.080

$154.680

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

$27.696

1k+ parts

-

10k+ parts

-

1,100

-

$27.696

-

-

Overview

Enhance your serial communication systems with the TL16C451FNR from Texas Instruments. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled quality and reliability. From seamless data transfer to efficient communication protocols, this chip carrier package boasts a wide range of applications in various industries. Elevate your projects with the maximum supply voltage of 5.25V and data encoding/decoding methods like NRZ. Trust Texas Instruments to deliver top-notch technology that maximizes performance while providing exceptional value to customers. Upgrade to the TL16C451FNR today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures long-lasting performance while keeping the overall weight of the product low.

Surface Mount: YES

Allows for easy and efficient PCB assembly, making it suitable for automated manufacturing processes.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, providing a wider operating range and increased reliability.

Address Bus Width: 3

Supports efficient communication and data exchange with other components or devices through a wider address bus.

Maximum Operating Temperature: 70 °C

Can operate effectively in various environmental conditions, making it suitable for different applications.

Maximum Data Transfer Rate: 0.03125 MBps

Capable of transmitting data at a decent speed, ensuring smooth and efficient communication between devices.

Data Encoding or Decoding Method: NRZ

Uses Non-Return-to-Zero encoding method for accurate data transmission, minimizing errors and ensuring data integrity.

Maximum Clock Frequency: 5.71 MHz

Supports high clock frequencies for fast data processing, making it ideal for applications requiring quick response times.

Bus Compatibility: IBM PC-AT

Compatible with IBM PC-AT bus systems, ensuring seamless integration and communication with existing hardware.

Technical Specifications

Serial Communication Controllers TL16C451FNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

CENTRONIX PRINTER INTERFACE

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

5.71 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.03125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

8

No. of Serial I/Os:

1

No. of Terminals:

68

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C451FNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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