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SCC2691AC1D24,512

NXP Semiconductors

SCC2691AC1D24,512 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1D24,512 is a Serial Communication Controller with 5V supply voltage, 4 MHz clock frequency, and 0.0046875 MBps data transfer rate. It is used for asynchronous communication protocols in commercial-grade applications requiring low power mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 7,157 parts In-Stock

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Anansix

USA . 1,774 parts In-Stock

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Digiode

USA . 1,418 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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J2 Sourcing AB

Sweden . 19 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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PC Components Company LLC

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 576 parts In-Stock

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$5.452

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One Stop Electronics

USA . 1,104 parts In-Stock

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$7.000

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Ampacity Inc.

Singapore . 512 parts In-Stock

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$23.000

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Advanced Electronics

New Zealand . 24 parts In-Stock

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$42.192

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$38.395

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$34.597

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QUARKTWIN TECHNOLOGY LTD

USA . 28,310 parts In-Stock

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Microchip USA

USA . 7,525 parts In-Stock

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Continental Prestige Electronics

USA . 4,485 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 2,009 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

Spain . 831 parts In-Stock

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Overview

Enhance your communication systems with the SCC2691AC1D24,512 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This Serial Communication Controller is perfect for various applications, offering seamless data transfer at an impressive rate. With low power consumption and high performance, this product delivers exceptional value to customers seeking efficient communication solutions. Upgrade your technology with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while maintaining a low cost.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for flexibility in power supply requirements, making it compatible with a wider range of systems.

Address Bus Width: 3

A wider address bus width allows for more memory addressing capability, which can be beneficial for applications requiring data storage and retrieval.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and easy to integrate into existing designs, making the product a convenient choice for system integration.

Power Supplies (V): 5

Having a stable power supply at 5V ensures reliable performance and compatibility with standard power sources.

No. of Terminals: 24

A higher number of terminals provide more connectivity options and flexibility for interfacing with other components in a system.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB and allow for higher component density, ideal for compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures the product can operate in systems with lower power requirements, offering versatility in different applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliable performance in various settings.

Maximum Data Transfer Rate: 0.0046875 MBps

This high data transfer rate enables fast and efficient communication, reducing latency and improving system performance.

Technical Specifications

Serial Communication Controllers SCC2691AC1D24,512 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

1

No. of Serial I/Os:

1

No. of Terminals:

24

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

2.65 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SCC2691AC1D24,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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