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TL16C554IFNR

Texas Instruments

TL16C554IFNR by Texas Instruments

TL16C554IFNR by Texas Instruments is a Serial Communication Controller with 5V supply, 16MHz clock frequency, and 0.125 MBps data transfer rate. It is used in industrial applications for asynchronous communication protocols and has a temperature range of -40 to 85°C.

Median Price

$26.660

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$26.660

100+ parts

$26.440

1k+ parts

$23.750

10k+ parts

-

250

$26.660

$26.440

$23.750

-

Rochester

USA . 7,980 parts In-Stock

1+ parts

-

100+ parts

$21.380

1k+ parts

$19.130

10k+ parts

$18.000

7,980

-

$21.380

$19.130

$18.000

Verical

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

$26.725

1k+ parts

$23.913

10k+ parts

$22.500

4,975

-

$26.725

$23.913

$22.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$9.417

100+ parts

-

1k+ parts

-

10k+ parts

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150

$9.417

-

-

-

Digiode

USA . 290 parts In-Stock

1+ parts

$17.850

100+ parts

-

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-

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290

$17.850

-

-

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Vyrian

USA . 4,571 parts In-Stock

1+ parts

-

100+ parts

-

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4,571

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-

-

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Chip Stock

USA . 2,523 parts In-Stock

1+ parts

-

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2,523

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,635 parts In-Stock

1+ parts

$9.417

100+ parts

-

1k+ parts

-

10k+ parts

$9.229

4,635

$9.417

-

-

$9.229

Ampacity Inc.

Singapore . 4,284 parts In-Stock

1+ parts

$15.970

100+ parts

-

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-

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4,284

$15.970

-

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Corphita

USA . 3,728 parts In-Stock

1+ parts

$16.911

100+ parts

-

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10k+ parts

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3,728

$16.911

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-

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Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

$44.828

100+ parts

-

1k+ parts

-

10k+ parts

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1,844

$44.828

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-

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DigiPath Technology Company

USA . 660 parts In-Stock

1+ parts

$49.362

100+ parts

-

1k+ parts

-

10k+ parts

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660

$49.362

-

-

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ChromeModa Solutions

Germany . 5,363 parts In-Stock

1+ parts

$50.369

100+ parts

$41.303

1k+ parts

-

10k+ parts

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5,363

$50.369

$41.303

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$50.369

100+ parts

$47.851

1k+ parts

$45.332

10k+ parts

-

893

$50.369

$47.851

$45.332

-

Microchip USA

USA . 1,590 parts In-Stock

1+ parts

$52.980

100+ parts

$52.230

1k+ parts

$51.850

10k+ parts

$51.470

1,590

$52.980

$52.230

$51.850

$51.470

A-Z Elektronik GmbH

Germany . 5,076 parts In-Stock

1+ parts

-

100+ parts

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5,076

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Argo Parts USA

USA . 4,802 parts In-Stock

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4,802

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$9.229

1k+ parts

$8.947

10k+ parts

$8.758

2,000

-

$9.229

$8.947

$8.758

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Perfect Parts

USA . 112 parts In-Stock

1+ parts

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112

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Overview

Discover the Texas Instruments TL16C554IFNR, a cutting-edge Serial Communication Controller that sets the standard for quality and reliability. Manufactured by industry leader Texas Instruments, this versatile chip is perfect for a wide range of applications. With its high performance and maximum data transfer rate of 0.125 MBps, this product offers unparalleled value and benefits to customers looking for seamless communication solutions. Upgrade your systems with the TL16C554IFNR and experience the advantages of top-notch technology in action.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage: 5.25 V

Having a high maximum supply voltage allows for flexibility in power source options.

Package Style: CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor for the product.

Maximum Data Transfer Rate: 0.125 MBps

With a high maximum data transfer rate, this product can handle fast communication speeds effectively.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency ensures efficient and high-speed operation of the product.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand challenging environmental conditions.

Technical Specifications

Serial Communication Controllers TL16C554IFNR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

4

No. of Terminals:

68

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C554IFNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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