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TL16C550BFN

Texas Instruments

TL16C550BFN by Texas Instruments

TL16C550BFN by Texas Instruments is a serial communication controller with a max data transfer rate of 0.0686 MBps. It has a temperature range of 0 to 70 °C and is commonly used in applications requiring asynchronous and bit communication protocols.

Median Price

$3.100

Lifecycle Status

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29

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1k+

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Rochester

USA . 770 parts In-Stock

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$2.770

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$2.480

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$2.340

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DigiKey

USA . 770 parts In-Stock

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Verical

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Q Components

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DigiKey Marketplace

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EMSNET

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Elcom Components

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Electronics Depot

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Legend Electronics Inc.

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Bristol Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Prism Electronics

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ComSIT Distribution GmbH

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ECAB

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Connector Distribution Corp

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Right Parts Inc.

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Sensible Micro Corp

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Semtec, LLC

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J & M Industries LLC

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Corel Iberica Componentes, S.L.

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Inventory MP

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MRC Electronics

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PAR Electronics

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Microfarads

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Distributors (Availability)

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Aranea Global

USA . 50 parts In-Stock

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$2.685

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$2.578

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Corphita

USA . 1,297 parts In-Stock

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Ampacity Inc.

Singapore . 205 parts In-Stock

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Microchip USA

USA . 15 parts In-Stock

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$20.670

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$20.610

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$20.540

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Parana Technologies

USA . 1,531 parts In-Stock

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DigiPath Technology Company

USA . 2,312 parts In-Stock

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ChromeModa Solutions

Germany . 4,313 parts In-Stock

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IDEA Electronic Components Group

UK . 1,330 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,514 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Discover the TL16C550BFN by Texas Instruments, a top-quality Serial Communication Controller designed to meet all your communication needs. With its advanced features and robust design, this product offers numerous benefits and advantages to customers. Manufactured by Texas Instruments, a renowned leader in the industry, you can trust the reliability and durability of this controller. Whether you're looking for seamless data transfer, efficient communication protocols, or easy installation, the TL16C550BFN delivers it all. Ideal for a wide range of applications, this controller is perfect for industries such as telecommunications, industrial automation, and consumer electronics. Upgrade your communication system today with the TL16C550BFN and experience the value and performance it brings.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the serial communication controller, making it a reliable choice.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into various electronic devices, making it convenient to use.

Maximum Supply Voltage:

5.25 V - With a high maximum supply voltage, this serial communication controller can handle power fluctuations effectively, ensuring stable performance.

Address Bus Width:

3 - The wide address bus width of 3 allows for efficient data processing and communication, enhancing the controller's performance.

Package Shape:

SQUARE - The square package shape provides compactness and space-saving capabilities, making it suitable for applications with limited space.

Power Supplies (V):

5 - The power supplies at 5 V ensure compatibility and ease of use with common power sources, making it a versatile option.

No. of Terminals:

44 - With a higher number of terminals, this serial communication controller can connect to multiple devices and handle complex communications, expanding its functionality.

Package Style (Meter):

CHIP CARRIER - The chip carrier package style offers a secure and reliable connection, minimizing signal interferences and improving overall performance.

Minimum Supply Voltage:

4.75 V - The low minimum supply voltage ensures efficient power consumption, reducing energy waste and increasing the lifespan of the product.

Maximum Operating Temperature:

70 °C - The high maximum operating temperature allows the serial communication controller to function reliably even in harsh environmental conditions.

Maximum Data Transfer Rate:

0.068603515625 MBps - With a high maximum data transfer rate, this controller can handle fast and efficient communication, enhancing the overall system's productivity.

Minimum Operating Temperature:

0 °C - The low minimum operating temperature ensures the controller's reliable performance even in colder environments, expanding its usability.

Terminal Position:

QUAD - The quad terminal position provides stability and ease of connection, making it convenient for installation and maintenance.

Maximum Seated Height:

4.57 mm - With a low maximum seated height, this serial communication controller can be easily incorporated into compact designs without compromising space requirements.

Width:

16.5862 mm - The width of 16.5862 mm offers compatibility with standard design specifications, making it a versatile choice for various applications.

Data Encoding or Decoding Method:

NRZ - The NRZ data encoding or decoding method ensures accurate and reliable communication, minimizing errors for precise data transmission.

External Data Bus Width:

8 - The wide external data bus width of 8 allows for efficient data processing and transfer, improving the overall performance of the controller.

Communication Protocol:

ASYNC, BIT - Supporting the ASYNC and BIT communication protocols, this controller offers compatibility with a wide range of devices, making it suitable for diverse applications.

Maximum Clock Frequency:

3.072 MHz - With a high maximum clock frequency, this serial communication controller can handle fast data processing and communication, optimizing system performance.

Length:

16.5862 mm - The length of 16.5862 mm ensures compatibility with standard design specifications, making it suitable for various product integration scenarios.

Temperature Grade:

COMMERCIAL - With a commercial temperature grade, this controller is suitable for normal operating conditions, making it ideal for most commercial applications.

Peripheral IC Type:

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - Being a serial IO/communication controller, it enables efficient serial communication and enhances the capabilities of connected devices.

Technology:

MOS - Built with MOS technology, this controller offers high performance with low power consumption, making it an energy-efficient and reliable choice.

Terminal Form:

J BEND - The J bend terminal form provides secure connections and ease of soldering, ensuring the controller's reliability and ease of integration.

Maximum Supply Current:

10 mA - With a low maximum supply current, this serial communication controller minimizes power consumption, making it an efficient option.

Nominal Supply Voltage:

5 V - The nominal supply voltage at 5 V ensures compatibility with common power sources, making it easy to integrate into various systems.

No. of Serial I/Os:

1 - With one serial input/output, this controller can handle single-channel communication and is suitable for applications where single data streams are sufficient.

Terminal Pitch:

1.27 mm - The terminal pitch of 1.27 mm offers compatibility with standard design specifications, allowing for easy integration into various electronic systems.

Technical Specifications

Serial Communication Controllers TL16C550BFN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

3.072 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.068603515625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

TL16C550BFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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