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PR5331C3HN/C360,51

NXP Semiconductors

PR5331C3HN/C360,51 by NXP Semiconductors

PR5331C3HN/C360,51 by NXP Semiconductors is a versatile serial communication controller designed for robust applications. It operates b/w -30 °C and 85 °C, supports dual power supplies (3.3V/5V), and features a compact 40-terminal chip carrier design. Ideal for embedded systems requiring reliable data transmission in space-constrained environments.

Median Price

$9.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,210 parts In-Stock

1+ parts

-

100+ parts

$8.080

1k+ parts

$7.230

10k+ parts

$6.810

28,210

-

$8.080

$7.230

$6.810

Verical

USA . 28,210 parts In-Stock

1+ parts

-

100+ parts

$10.100

1k+ parts

$9.037

10k+ parts

$8.512

28,210

-

$10.100

$9.037

$8.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,896 parts In-Stock

1+ parts

$8.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,896

$8.560

-

-

-

Vyrian

USA . 4,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,928

-

-

-

-

Anansix

USA . 1,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,271 parts In-Stock

1+ parts

$8.109

100+ parts

-

1k+ parts

-

10k+ parts

-

3,271

$8.109

-

-

-

AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$19.130

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$19.130

-

-

-

Component Stockers USA

USA . 620 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$99.990

-

-

-

UNI Independent Distributors

Spain . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Overview

Unlock seamless connectivity with the PR5331C3HN/C360,51 from NXP Semiconductors, a leader in precision engineering. Designed for robust performance in diverse environments, this serial communication controller ensures reliability and efficiency for your applications. With its compact, surface-mount design, it fits effortlessly into modern circuits. Choose NXP for quality you can trust, enhancing your projects with unmatched value and superior benefits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for efficient space utilization on PCBs, making it ideal for compact electronic designs.

Package Shape: SQUARE

The square package shape provides a balanced design that can optimize layout and thermal performance on the circuit board.

Power Supplies (V): 3.3, 5

Compatibility with both 3.3V and 5V power supplies makes this product versatile for a variety of systems and applications.

No. of Terminals: 40

Having 40 terminals allows for a substantial number of connections, enabling complex functionalities and ease of integration into various designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style is designed for high-density applications, supporting advanced circuit configurations while maintaining performance.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C enhances reliability in warmer environments, making it suitable for industrial applications.

Minimum Operating Temperature: -30 °C

With a low operating temperature of -30 °C, this product is ideal for use in colder conditions, extending its applicability across varied climates.

Terminal Position: QUAD

Quad terminal positioning simplifies soldering and enhances connectivity options on the PCB, contributing to robust performance.

Terminal Form: NO LEAD

The no-lead design helps in reducing pad size on PCBs, facilitating better heat dissipation and making it environmentally friendly.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for a compact design, supporting higher density arrangements and making it suitable for space-constrained applications.

Technical Specifications

Serial Communication Controllers PR5331C3HN/C360,51 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

PR5331C3HN/C360,51 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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