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NT2H0301F0DTP,118

NXP Semiconductors

NT2H0301F0DTP,118 by NXP Semiconductors

NT2H0301F0DTP,118 by NXP Semiconductors is a compact serial communication controller designed for reliable performance in various applications. It operates b/w -25 °C and 70 °C, features an 8-terminal dual position layout, and supports surface mount technology. Ideal for space-constrained designs, it ensures efficient data transmission with a peak reflow temp of 260 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,025 parts In-Stock

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6,025

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Anansix

USA . 2,089 parts In-Stock

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2,089

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Digiode

USA . 1,113 parts In-Stock

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1,113

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Distributors (Availability)

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$16.110

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436

$16.110

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One Stop Electronics

USA . 391 parts In-Stock

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$17.000

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391

$17.000

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UNI Independent Distributors

Spain . 7,954 parts In-Stock

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7,954

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QUARKTWIN TECHNOLOGY LTD

USA . 4,280 parts In-Stock

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4,280

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Corphita

USA . 422 parts In-Stock

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422

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Overview

Elevate your design with the NT2H0301F0DTP,118 from NXP Semiconductors, a leader in quality and innovation. This reliable serial communication controller ensures seamless connectivity and performance for a variety of applications, from consumer electronics to industrial systems. With its compact design and robust temperature range, it delivers exceptional value and efficiency, empowering you to create cutting-edge solutions that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the controller reliable in various applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient assembly on PCBs, enabling high-density designs.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient space utilization on circuit boards, making it ideal for compact devices.

No. of Terminals: 8

With 8 terminals, the controller offers a versatile interface for connecting to other components, facilitating various design requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, fitting easily into space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability under moderate thermal conditions, making it suitable for many environments.

Minimum Operating Temperature: -25 °C

The capability to operate at -25 °C expands the product’s usability in colder environments, enhancing its flexibility in application.

Terminal Position: DUAL

Dual terminal positions provide mounting flexibility and ease of integration, accommodating various PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds supports efficient soldering processes, ensuring good joint integrity without compromising component integrity.

Peak Reflow Temperature °C: 260

Handling peak reflow temperatures of 260 °C indicates robust construction that can withstand soldering processes without failure.

Terminal Form: NO LEAD

The no-lead design minimizes PCB space and enhances thermal and electrical performance, making it ideal for high-density applications.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5 mm allows for denser packaging of components, crucial for advanced electronic devices.

Technical Specifications

Serial Communication Controllers NT2H0301F0DTP,118 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NT2H0301F0DTP,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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