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NT2H1611F0DTLH

NXP Semiconductors

NT2H1611F0DTLH by NXP Semiconductors

NT2H1611F0DTLH by NXP Semiconductors is a Serial Communication Controller with 4 terminals, operating temperature range of -25 to 70°C. It features surface mount capability and nickel palladium gold terminal finish. Ideal for applications requiring reliable serial communication in various electronic devices.

Median Price

$0.743

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 859 parts In-Stock

1+ parts

$0.331

100+ parts

$0.315

1k+ parts

$0.305

10k+ parts

-

859

$0.331

$0.315

$0.305

-

Chip1Stop

Japan . 859 parts In-Stock

1+ parts

$0.743

100+ parts

$0.469

1k+ parts

-

10k+ parts

-

859

$0.743

$0.469

-

-

Mouser Electronics

USA . 4,116 parts In-Stock

1+ parts

$1.210

100+ parts

$0.904

1k+ parts

$0.770

10k+ parts

$0.583

4,116

$1.210

$0.904

$0.770

$0.583

DigiKey

USA . 3,936 parts In-Stock

1+ parts

$1.210

100+ parts

$0.903

1k+ parts

$0.787

10k+ parts

$0.690

3,936

$1.210

$0.903

$0.787

$0.690

Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.553

8,000

-

-

-

$0.553

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,650 parts In-Stock

1+ parts

$0.304

100+ parts

-

1k+ parts

-

10k+ parts

-

3,650

$0.304

-

-

-

Digiode

USA . 2,338 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

-

10k+ parts

-

2,338

$0.314

-

-

-

Chip Stock

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,500

-

-

-

-

Anansix

USA . 82 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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82

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,000 parts In-Stock

1+ parts

$0.298

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

$0.298

-

-

-

Lixinc

USA . 12,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,114

-

-

-

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Kepictronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Perfect Parts

USA . 3,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,910

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UNI Independent Distributors

Spain . 1,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,441

-

-

-

-

Overview

Experience the future of secure and convenient communication with the NT2H1611F0DTLH by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Serial Communication Controllers that are versatile and reliable. Whether you're looking to enhance your access control systems, streamline your payment processes, or improve your inventory management, this product offers unparalleled value, benefits, and advantages. Trust NXP Semiconductors to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and resistant to heat, making the product suitable for a wide range of operating temperatures.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 4

Having 4 terminals allows for more flexibility in connecting the product to other components or devices, enabling versatile applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures the product can function reliably even in cold environments, enhancing its overall reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold as terminal finish materials enhances the product's conductivity, resistance to corrosion, and overall longevity.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during installation reduces the risk of thermal stress on the product, ensuring its long-term durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and efficient soldering during assembly, contributing to the product's overall quality and performance.

Technical Specifications

Serial Communication Controllers NT2H1611F0DTLH attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC4,.08,20

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NT2H1611F0DTLH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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