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PC16552DV/NOPB

Texas Instruments

PC16552DV/NOPB by Texas Instruments

PC16552DV/NOPB by Texas Instruments is a Serial Communication Controller with 5V power supply, 24MHz clock frequency, and 0.1875 MBps data transfer rate. Ideal for asynchronous communication protocols in commercial-grade applications requiring serial I/Os and an external data bus width of 8 bits.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 8,939 parts In-Stock

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Digiode

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Anansix

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Chip Stock

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Nova Conductors

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ComSIT USA

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Flex Direct, LLC

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Bristol Electronics

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AZTECH Wire

Italy . 604 parts In-Stock

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$9.774

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Ampacity Inc.

Singapore . 516 parts In-Stock

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$14.000

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One Stop Electronics

USA . 1,124 parts In-Stock

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$28.000

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Semicontronic

India . 1,457 parts In-Stock

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$31.040

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Parana Technologies

USA . 1,462 parts In-Stock

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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ChromeModa Solutions

Germany . 1,450 parts In-Stock

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IDEA Electronic Components Group

UK . 453 parts In-Stock

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Corohmni

South Africa . 15 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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Argo Parts USA

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Corphita

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Authorized Procurement Solutions

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Lixinc

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Bastille Electronics

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Assy Fe

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Overview

Enhance your serial communication systems with the PC16552DV/NOPB from Texas Instruments. This high-quality Serial Communication Controller offers seamless data transfer at a blazing fast speed of 0.1875 MBps, ensuring efficient and reliable performance. With its surface-mount design and durable plastic/epoxy package body material, this chip carrier is perfect for a wide range of applications. Experience the value and benefits of this cutting-edge technology in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 5.5 V

Ability to handle a high maximum supply voltage ensures compatibility with a wide range of systems.

Address Bus Width: 3

A wider address bus width allows for more efficient data transfer between components.

Package Shape: SQUARE

The square package shape helps with space-saving and efficient layout on the circuit board.

Power Supplies (V): 5

A standard power supply voltage of 5V ensures compatibility with most systems.

No. of Terminals: 44

Having a high number of terminals provides more connectivity options and flexibility in system design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easy integration into electronic devices.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature ensures reliable performance even in harsh environments.

Maximum Data Transfer Rate: 0.1875 MBps

The high data transfer rate enables fast and efficient communication within the system.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature ensures the product can be used in a wide range of environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and corrosion resistance for the terminals.

External Data Bus Width: 8

A wider external data bus width allows for faster data transmission and processing.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocol ensures versatility in data transfer.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency enables fast processing and data transfer capabilities.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and performance in everyday applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Serial Communication Controllers PC16552DV/NOPB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.51 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.51 mm

Trade Compliance

PC16552DV/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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