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PC16550DV/NOPB

Texas Instruments

PC16550DV/NOPB by Texas Instruments

PC16550DV/NOPB by Texas Instruments is a Serial Communication Controller with 5V supply, 24MHz clock frequency, and 0.1875 MBps data rate. It is used for asynchronous communication in commercial applications like serial IO and communication control on an 8088 bus.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

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-

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$4.420

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$3.950

10k+ parts

$3.720

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$4.420

$3.950

$3.720

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$5.380

100+ parts

$4.040

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$3.500

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$5.380

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$3.500

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Digiode

USA . 5,063 parts In-Stock

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Vyrian

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Anansix

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Chip Stock

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349

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Connector Distribution Corp

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30

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Right Parts Inc.

USA . 30 parts In-Stock

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30

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Zilex Electronics Inc.

Canada . 18 parts In-Stock

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Bristol Electronics

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A&K Electronics

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Rotakorn

Sweden . 7 parts In-Stock

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Sogenti Electronics

Canada . 6 parts In-Stock

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PC Components Company LLC

USA . 5 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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ComSIT USA

USA . 5 parts In-Stock

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Avant Electronics Limited

UK . 1 parts In-Stock

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AZTECH Wire

Italy . 788 parts In-Stock

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$14.321

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$14.321

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One Stop Electronics

USA . 1,376 parts In-Stock

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$33.000

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Parana Technologies

USA . 2,013 parts In-Stock

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$39.399

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$39.399

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IDEA Electronic Components Group

UK . 1,352 parts In-Stock

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$44.269

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$42.056

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$39.842

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1,352

$44.269

$42.056

$39.842

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ChromeModa Solutions

Germany . 1,265 parts In-Stock

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$44.269

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$36.301

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$44.269

$36.301

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QUARKTWIN TECHNOLOGY LTD

USA . 25,787 parts In-Stock

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Authorized Procurement Solutions

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CPlus Electronics

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Perfect Parts

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Corphita

USA . 3,397 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 316 parts In-Stock

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$39.913

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Technoshack Inc. (Excess)

Canada . 16 parts In-Stock

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Overview

Enhance your communication systems with the PC16550DV/NOPB by Texas Instruments, a top-quality Serial Communication Controller that offers unmatched reliability and performance. Designed with precision and expertise, this product is perfect for various applications in the industry. With its advanced features and innovative design, customers can expect seamless data transfer at high speeds, ensuring efficient and effective communication processes. Invest in the PC16550DV/NOPB today and experience the value and benefits it brings to your projects. Trust Texas Instruments for cutting-edge solutions that elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for more flexibility in power supply options.

Address Bus Width: 3

A wider address bus width enables the controller to handle larger amounts of memory and devices.

Package Shape: SQUARE

The square package shape facilitates easier handling and placement on the circuit board.

Power Supplies (V): 5

The standard 5V power supply is commonly available and compatible with many systems.

No. of Terminals: 44

Having a higher number of terminals allows for more connections and functionality in the controller.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and reliable packaging solution for the controller.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the controller can function reliably under various environmental conditions.

Maximum Data Transfer Rate: 0.1875 MBps

The high data transfer rate allows for fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the controller can still function in colder environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a corrosion-resistant and reliable connection for the controller.

Terminal Position: QUAD

The quad terminal position makes it easier to solder and connect the controller on the circuit board.

Maximum Seated Height: 4.57 mm

The low profile design with a maximum seated height of 4.57mm allows for compact and space-saving installations.

Width: 16.51 mm

The moderate width of 16.51mm ensures compatibility with standard spacing on circuit boards.

Data Encoding or Decoding Method: NRZ

The Non-Return-to-Zero (NRZ) encoding method is reliable and efficient for serial data transmission.

External Data Bus Width: 8

An external data bus width of 8 allows for handling larger chunks of data at a time for improved performance.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-wise data transmission allows for flexible and versatile communication options.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency enables fast data processing and communication speeds.

Maximum Time At Peak Reflow Temperature (s): 30

The controller can withstand the peak reflow temperature for a sufficient amount of time during assembly processes.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, the controller can undergo soldering processes effectively.

Length: 16.51 mm

The length of 16.51mm ensures a compact form factor for easy integration into various systems.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, making it suitable for a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

This type of peripheral IC offers advanced serial communication capabilities for efficient data transfer.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: J BEND

J bend terminal form simplifies the soldering and mounting process on the circuit board.

Maximum Supply Current: 15 mA

Low maximum supply current consumption for efficient power usage and reduced heat generation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources.

Bus Compatibility: 8088

Compatibility with 8088 bus interface ensures seamless integration with existing systems and peripherals.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27mm allows for easy connection and mounting in various applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the controller can withstand mild exposure to moisture during handling and storage.

Technical Specifications

Serial Communication Controllers PC16550DV/NOPB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

8088

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.51 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.51 mm

Trade Compliance

PC16550DV/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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