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PC16550DV

Texas Instruments

PC16550DV by Texas Instruments

PC16550DV by Texas Instruments is a Serial Communication Controller with 44 terminals, operating at 5V. It supports data transfer rates up to 0.1875 MBps and communication protocols like ASYNC and BIT. Ideal for applications requiring high-speed serial communication in commercial-grade environments.

Median Price

$6.912

Lifecycle Status

Suppliers In-Stock

60

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1k+

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Rochester

USA . 14,041 parts In-Stock

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DigiKey

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Verical

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Corphita

USA . 2,702 parts In-Stock

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Parana Technologies

USA . 1,209 parts In-Stock

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$53.022

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 1,875 parts In-Stock

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IDEA Electronic Components Group

UK . 1,622 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Overview

Enhance your communication systems with the Texas Instruments PC16550DV Serial Communication Controller. Manufactured with precision and quality in mind, this versatile chip offers seamless data transfer rates and reliable performance. Perfect for a wide range of applications, from industrial automation to telecommunications, this chip provides value and efficiency to your projects. Trust Texas Instruments for cutting-edge technology and superior products that deliver exceptional results every time. Choose the PC16550DV for all your serial communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY offers good durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltage, making it compatible with various power sources.

Address Bus Width: 3

A wider address bus width allows for efficient and fast data communication between devices.

Package Shape: SQUARE

Square shape is easy to handle and integrate into circuit designs.

Power Supplies (V): 5

Standard power supply voltage that is commonly available and easy to work with.

No. of Terminals: 44

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good thermal performance and protection for the IC.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable operation in various environments.

Maximum Data Transfer Rate: 0.1875 MBps

High data transfer rate enables fast communication between devices.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to other components.

Maximum Seated Height: 4.57 mm

Low seated height allows for compact design and efficient use of space.

Width: 16.51 mm

Standard width for easy integration into circuit boards and designs.

Data Encoding or Decoding Method: NRZ

NRZ encoding method simplifies data transmission and decoding processes.

External Data Bus Width: 8

Wide external data bus width allows for faster data transfer between the device and peripherals.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level data transfer protocols for versatility.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast and efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 20

Can withstand peak reflow temperature for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 220

High peak reflow temperature for effective soldering and assembly.

Length: 16.51 mm

Standard length for easy integration into circuit designs and assemblies.

Temperature Grade: COMMERCIAL

Designed for commercial grade applications with reliable performance under normal operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specialized for serial communication and input/output control, suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

J bend terminal form provides secure and reliable connection to other components and devices.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with most systems and power sources.

Bus Compatibility: 8088

Compatible with 8088 bus systems for seamless integration into existing architectures.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy soldering and connection to circuit boards.

Moisture Sensitivity Level (MSL): 2A

Low moisture sensitivity level for reliable performance and durability in various environmental conditions.

Technical Specifications

Serial Communication Controllers PC16550DV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

8088

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.51 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2A

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

220

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16.51 mm

Trade Compliance

PC16550DV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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