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PC16552DV

Texas Instruments

PC16552DV by Texas Instruments

PC16552DV by Texas Instruments is a Serial Communication Controller with 5V power supply, 24MHz clock frequency, and 0.1875 MBps data transfer rate. It is used for asynchronous communication protocols in commercial-grade applications requiring serial I/Os and 8-bit external data bus width.

Median Price

$6.460

Lifecycle Status

Suppliers In-Stock

56

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,799 parts In-Stock

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$6.460

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$6.330

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One Stop Electronics

USA . 1,470 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 410 parts In-Stock

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$8.568

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Parana Technologies

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DigiPath Technology Company

USA . 1,986 parts In-Stock

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$66.621

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ChromeModa Solutions

Germany . 5,020 parts In-Stock

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IDEA Electronic Components Group

UK . 208 parts In-Stock

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$70.197

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A-Z Elektronik GmbH

Germany . 5,316 parts In-Stock

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UK . 128 parts In-Stock

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Overview

Elevate your communication systems with the Texas Instruments PC16552DV Serial Communication Controller. Manufactured by industry leader Texas Instruments, this chip carrier package offers reliable serial I/O capabilities for a wide range of applications. From enhancing data transfer rates to improving asynchronous communication protocols, this high-quality product ensures seamless connectivity and efficient performance. Upgrade your devices today and experience the superior value and benefits that the PC16552DV brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resilient, making the product suitable for a wide range of environments.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

Data Encoding or Decoding Method: NRZ

NRZ encoding/decoding method provides efficient and reliable data transmission, ensuring the integrity of communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for versatile connectivity options and the ability to handle multiple data streams simultaneously.

Technical Specifications

Serial Communication Controllers PC16552DV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.51 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2A

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

220

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16.51 mm

Trade Compliance

PC16552DV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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