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MCP2515-I/STVAO

Microchip Technology

MCP2515-I/STVAO by Microchip Technology

MCP2515-I/STVAO by Microchip: 5.5V max supply, 0.125 MBps data rate, -40 to 85 °C temp range. Ideal for CAN communication in automotive applications due to AEC-Q100 screening and SPI bus compatibility.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

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100

$1.830

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Vyrian

USA . 8,375 parts In-Stock

1+ parts

-

100+ parts

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8,375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.793

100+ parts

-

1k+ parts

$1.722

10k+ parts

-

50

$1.793

-

$1.722

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

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40

$1.830

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Continental Prestige Electronics

USA . 6,978 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

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10k+ parts

$1.793

6,978

$1.830

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-

$1.793

Argo Parts USA

USA . 2,350 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

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10k+ parts

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2,350

$1.830

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.885

100+ parts

$1.791

1k+ parts

$1.791

10k+ parts

-

2,500

$1.885

$1.791

$1.791

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Modulus Dynamics

Lithuania . 64 parts In-Stock

1+ parts

$2.031

100+ parts

$2.011

1k+ parts

$1.950

10k+ parts

-

64

$2.031

$2.011

$1.950

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Ampacity Inc.

Singapore . 847 parts In-Stock

1+ parts

$7.000

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847

$7.000

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$11.449

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760

$11.449

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Aztec Data Supply Inc.

USA . 869 parts In-Stock

1+ parts

$16.330

100+ parts

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869

$16.330

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Semicontronic

India . 1,344 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

10k+ parts

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1,344

$20.000

$19.500

$19.400

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Vigor

Singapore . 6,240 parts In-Stock

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6,240

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RGB Technical Solutions

Ukraine . 2,973 parts In-Stock

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2,973

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Microchip USA

USA . 1,442 parts In-Stock

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1,442

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Robosynatics

Brazil . 950 parts In-Stock

1+ parts

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950

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Lucentia Tech

USA . 950 parts In-Stock

1+ parts

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100+ parts

$0.060

1k+ parts

$0.060

10k+ parts

$0.060

950

-

$0.060

$0.060

$0.060

Overview

Enhance your communication systems with the top-quality MCP2515-I/STVAO by Microchip Technology. As a leader in the industry, Microchip Technology delivers reliable and innovative solutions for Serial Communication Controllers. This versatile product offers exceptional value with its high-speed data transfer rate, low power mode, and industrial temperature grade. Whether you're working on automotive applications or industrial automation, the MCP2515-I/STVAO ensures seamless connectivity and optimal performance. Upgrade your projects today and experience the benefits of cutting-edge technology with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, making it a good choice for portable applications.

Surface Mount: YES

This product can be easily mounted on circuit boards, saving space and simplifying the assembly process, making it a good choice for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product is versatile and can be used in a wide range of applications, making it a good choice for various voltage requirements.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing, making this product suitable for high-speed communication applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality in automotive applications, making this product a good choice for automotive communication systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing designs, making this product a convenient choice for retrofitting.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options, making it versatile and suitable for complex communication setups.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product space-efficient and ideal for compact designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures energy efficiency and compatibility with various power sources, making this product a reliable choice for power-sensitive applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate of 0.125 MBps ensures fast and efficient communication, making this product ideal for high-speed data transmission.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function reliably in cold environments, making it suitable for outdoor and automotive applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures a reliable connection, making this product durable and long-lasting.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout, making this product versatile and adaptable to various design constraints.

Maximum Seated Height: 1.2 mm

With a low maximum seated height, this product can be used in slim devices, making it a good choice for space-constrained applications.

RAM Words: 14

The 14 RAM words provide sufficient memory capacity for data storage and processing, making this product suitable for handling complex communication tasks.

Width: 4.4 mm

The compact width of 4.4 mm allows for efficient use of board space, making this product ideal for miniaturized designs.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding/decoding method ensures reliable data transmission, making this product a dependable choice for communication systems.

Communication Protocol: SYNC; BIT; BYTE

With support for various communication protocols, including sync, bit, and byte, this product offers compatibility with a range of devices, making it versatile and adaptable.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz enables fast data processing, making this product suitable for high-performance communication tasks.

Length: 6.5 mm

The compact length of 6.5 mm allows for efficient use of board space, making this product ideal for compact and space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and durability in harsh environments, making this product suitable for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, CAN

The peripheral IC type of serial IO/communication controller, CAN, enhances the functionality and compatibility of this product, making it a versatile choice for communication systems.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high reliability, making this product energy-efficient and durable.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection and ease of soldering, making this product reliable and easy to integrate into circuits.

Maximum Supply Current: 10 mA

With a low maximum supply current of 10 mA, this product conserves energy and prolongs battery life, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides stable power delivery, making this product reliable and compatible with standard power sources.

Bus Compatibility: SPI

The SPI bus compatibility allows for easy integration with SPI devices, making this product versatile and suitable for a wide range of applications.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm provides ample spacing for connections, making this product easy to solder and suitable for high-density designs.

Low Power Mode: YES

The low power mode option allows for energy-saving operation, making this product suitable for battery-powered devices and extending battery life.

Technical Specifications

Serial Communication Controllers MCP2515-I/STVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Low Power Mode:

YES

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

20

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Words:

14

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MCP2515-I/STVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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