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93LC66BT-I/MNY

Microchip Technology

93LC66BT-I/MNY by Microchip Technology

93LC66BT-I/MNY by Microchip Technology is a 256x16 EEPROM with 1000000 Write/Erase Cycles. Operating at 2 MHz, it has a memory density of 4096 bit and supports MICROWIRE serial bus type. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.

Median Price

$0.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 18,310 parts In-Stock

1+ parts

$0.410

100+ parts

$0.370

1k+ parts

$0.350

10k+ parts

$0.340

18,310

$0.410

$0.370

$0.350

$0.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 16,500 parts In-Stock

1+ parts

$0.420

100+ parts

$0.380

1k+ parts

$0.340

10k+ parts

-

16,500

$0.420

$0.380

$0.340

-

Vyrian

USA . 7,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,880

-

-

-

-

VNN

France . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

968

-

-

-

-

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 22,280 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

22,280

$0.760

-

-

-

AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$12.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$12.550

-

-

-

West Coast Incorporated

USA . 4,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,086

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

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Overview

Enhance your electronic projects with the reliable and high-quality 93LC66BT-I/MNY EEPROM by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch performance and durability in all their products. Ideal for a wide range of applications, this EEPROM offers unmatched value with features like software write protection, industrial temperature grade, and 1,000,000 write/erase cycles. Upgrade your designs with ease and confidence using the 93LC66BT-I/MNY EEPROM. Elevate your projects to the next level with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various operating environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures reliable performance and compatibility with many systems.

Organization: 256X16

This organization allows for efficient storage and retrieval of data in a structured manner, enhancing overall functionality.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this EEPROM can operate in extreme cold conditions without any issues.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures longevity and reliability, making this EEPROM a durable choice for frequent read/write operations.

Maximum Clock Frequency (fCLK): 2 MHz

The high clock frequency allows for fast data transfer and processing, improving overall performance.

Memory Density: 4096 bit

With a high memory density, this EEPROM can store a large amount of data in a compact space, making it efficient for various applications.

Serial Bus Type: MICROWIRE

Microwire serial bus communication protocol offers fast data transfer rates and efficient communication with other devices, enhancing connectivity.

Technical Specifications

EEPROM 93LC66BT-I/MNY attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Width:

2 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93LC66BT-I/MNY Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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