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XCF01SVO20CES

Xilinx

XCF01SVO20CES by Xilinx

Xilinx XCF01SVO20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology chip has a small outline package with dual terminal position and 0.65mm pitch.

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Overview

Unlock a world of possibilities with the XCF01SVO20CES by Xilinx, the leading manufacturer in the industry. This high-quality EEPROM is perfect for a wide range of applications, offering seamless operation and reliability. Experience the value and benefits of this product as it provides unparalleled performance and efficiency. Trust Xilinx to deliver superior technology that meets all your needs. Elevate your projects with the XCF01SVO20CES and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring reliability in various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Enables fast and efficient data transfer between the EEPROM and the system.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages, making integration into existing systems seamless.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with a wide operating temperature range.

No. of Words: 1048576 words

Provides ample storage capacity for configuration data or other information in the EEPROM.

Memory Density: 1048576 bit

High memory density allows for storing a large amount of data in a compact form factor.

Technical Specifications

EEPROM XCF01SVO20CES attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5024 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

XCF01SVO20CES Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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