Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCF01SVO20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and uses CMOS technology. Ideal for industrial applications, this SERIAL memory IC features a 0.65mm terminal pitch in a SMALL OUTLINE package style.
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Plastic and epoxy material provides durability and resistance to environmental factors, making this product suitable for a variety of applications.
Surface mount design allows for easy and efficient installation on printed circuit boards, saving space and simplifying assembly processes.
Operates at a standard voltage of 3.3V, making it compatible with a wide range of systems and applications.
Synchronous operation ensures precise and synchronized data transfers, improving overall system performance and reliability.
High memory density allows for storing a large amount of data in a compact form factor, making this product ideal for applications with high data storage requirements.
EEPROM XCF01SVO20C0936 attributes and parameters. Explore more EEPROM devices from Xilinx
JESD-30 Code:
JESD-609 Code:
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No. of Words Code:
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Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
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Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
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Technology:
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Width:
XCF01SVO20C0936 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SS14
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
CAT24C04WI-GT3
Catalyst Semiconductor
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; I2C Control Byte: 1010DDMR;
AT24C256C-SSHL-T-899
AT24C256C-SSHL-T-899 by Microchip is a 32KX8 EEPROM with 262144-bit memory density. It operates at 1 MHz clock frequency, has I2C serial bus type, and supports synchronous mode. Ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package.
AT21CS01-STUM17-T
Atmel
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words: 128 words;
M95M01-DWMN3TP/K
STMicroelectronics
STMicroelectronics' M95M01-DWMN3TP/K is an AEC-Q100 EEPROM with 128KX8 organization, operating at 3/5V. It offers 4000000 Write/Erase Cycles endurance, SPI serial bus type, and -40 to 125 °C temperature range. Ideal for automotive applications due to its small outline package and high reliability.
25LC512-E/SN
25LC512-E/SN by Microchip Technology is a 64KX8 EEPROM with 524288 bit memory density. Operating at 5V, it offers synchronous mode and SPI serial bus type for automotive applications. With endurance of 1M cycles, it supports hardware/software write protection and has a max clock frequency of 10 MHz.
M24C02-RMN6TP
M24C02-RMN6TP by STMicroelectronics is an EEPROM with 256x8 organization, I2C serial bus type, and 1000000 write/erase cycles endurance. It operates at a max clock frequency of 0.4 MHz and is suitable for industrial temperature grade applications.
CAT24C64WI-GT3
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 8192 words;
AT25128B-XHL-T
AT25128B-XHL-T by Microchip Technology is a 16KX8 EEPROM with SPI serial bus type, offering 131072 bit memory density. It operates at a max clock frequency of 20 MHz and has an endurance of 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage.
AT24C64BN-10SU-2.7-T
AT24C64BN-10SU-2.7-T by Microchip is an 8KX8 EEPROM with a serial I2C bus type, operating at 0.4 MHz clock frequency and 3V nominal voltage. It is ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package style.
M24512-RMN6P
M24512-RMN6P by STMicroelectronics is an EEPROM with 64KX8 organization, operating at 2.5V and featuring I2C control byte 1010DDDR. It has a memory density of 524288 bit, endurance of 4M cycles, and operates in industrial temperature range. Ideal for applications requiring reliable non-volatile memory storage with serial bus interface.
CAT24C02YI-GT3
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
AT24C512C-XHM-B
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
AT25256B-XHL-T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
DS24B33G+T&R
Analog Devices
Analog Devices' DS24B33G+T&R is a 1-WIRE serial EEPROM with 4Kx1 organization, operating from -40 to 85°C. Featuring a supply voltage range of 2.8V to 5.25V, it offers a memory density of 4096 bits for industrial applications in compact square chip carrier packages.
S29GL256S90FHI020
Spansion
EEPROM CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 11 mm;
M24C32-RMN6TP
M24C32-RMN6TP by STMicroelectronics is an EEPROM with 4Kx8 organization, I2C serial bus type, and 1000000 write/erase cycles endurance. It operates at a max clock frequency of 0.4 MHz and has a memory density of 32768 bits. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.
93C46B/SN
93C46B/SN by Microchip Technology is a 1024-bit EEPROM with 64x16 organization, operating at 5V. It features synchronous operation, hardware/software write protection, and MICROWIRE serial bus type. Ideal for applications requiring small outline packages and low power consumption.
AT93C66B-SSHM-T
AT93C66B-SSHM-T by Microchip Tech is a 256x16 EEPROM with 2MHz clock freq. Ideal for industrial temp applications, it offers 1.8/5V power supplies, software write protection, and MICROWIRE serial bus type. With 1000000 write/erase cycles endurance, this small outline package has a max seated height of 1.75mm.
AT24C02D-XHM-B
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
AT25256B-SSHL-T
AT25256B-SSHL-T by Microchip Technology is a 32KX8 EEPROM with 3-STATE output, SPI serial bus type, and 20 MHz clock frequency. It operates at -40 to 85 °C and has a supply voltage of 4.5V to 5.5V. Ideal for industrial applications requiring reliable non-volatile memory storage.
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XCF01SVOG20C
Xilinx
The Xilinx XCF01SVOG20C is a 1MX1 NOR type EEPROM with a memory density of 1048576 bits. It operates at a nominal voltage of 3.3V and has an endurance of 20000 write/erase cycles. This configuration memory is commonly used in industrial applications for storing and retrieving data efficiently.
XCF02SVOG20C
Xilinx XCF02SVOG20C is a 2MX1 NOR EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, 0.65mm terminal pitch, and Gull Wing terminals, it's ideal for configuration memory needs in various electronic devices.
XCF04SVO20C
Xilinx XCF04SVO20C is a 3.3V EEPROM with 4MX1 organization, NOR type, and 33MHz clock frequency. Ideal for industrial applications, it offers 4194304-bit memory density in a small outline package with dual terminals and Gull Wing form factor.
XCF04SVOG20C0936
Xilinx XCF04SVOG20C0936 is a 4Mx1 EEPROM with 4194304-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial memory IC comes in a small outline package with dual terminal position and gull wing form factor.
XCF02SVOG20C0936
Xilinx XCF02SVOG20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade performance with -40 to 85°C temperature range. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminals and gull wing form factor.
XCF02SVOG20CES
Xilinx XCF02SVOG20CES is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device has a small outline package with 0.65mm terminal pitch.
XCF01SVOG20CES
Xilinx XCF01SVOG20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology device has a small outline package with dual terminal position and matte tin finish.
XCF01SVOG20C0100
Xilinx XCF01SVOG20C0100 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory in applications requiring small outline and thin profile packages.
XCF01SVOG20C0936
Xilinx XCF01SVOG20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 3.3V, -40 to 85 °C temperature range, suitable for industrial applications. The small outline package has 20 terminals, 0.65mm pitch, and GULL WING form factor for serial configuration memory use.
XCF02SVO20C
Xilinx XCF02SVO20C is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, it is ideal for configuration memory in devices requiring low standby current and high endurance.
XCF04SVO20CES
Xilinx XCF04SVO20CES is a 4Mx1 EEPROM with 4194304-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminal position and gull wing form factor.
XCF04SVO20C0936
Xilinx XCF04SVO20C0936 is a 4MX1 EEPROM with a memory density of 4194304 bit. It operates at a nominal voltage of 3.3V and has an industrial temperature grade. This configuration memory IC is commonly used in applications requiring synchronous operation and small form factor packaging.
XCF08PVOG48C
Xilinx XCF08PVOG48C is a 1.8V EEPROM with 8MX1 organization, NOR type, and 8388608-bit memory density. Operating at -40 to 85°C, it's ideal for industrial applications requiring a small outline package with thin profile and shrink pitch. With synchronous operation up to 33MHz, this configuration memory offers reliable performance in various electronic systems.
XCF01SVO20C
Xilinx XCF01SVO20C is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers 20000 Write/Erase Cycles endurance and supports NOR type technology. Ideal for industrial applications requiring configuration memory in a small outline package.
XCF02SVO20C0936
Xilinx XCF02SVO20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it has a small outline package and operates in industrial temperature range. Ideal for configuration memory applications, this CMOS technology device offers serial interface with 0.65mm terminal pitch.
XCF02SVO20CES
Xilinx XCF02SVO20CES is a 2Mx1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it features a small outline package and operates in industrial temperature range. Ideal for configuration memory applications, it offers serial interface and dual terminal position with 0.65mm pitch.
XCF01SVO20CES
Xilinx XCF01SVO20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology chip has a small outline package with dual terminal position and 0.65mm pitch.
XCF08PFSG48C
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 8388608 bit;
XCF08PFS48C
Xilinx XCF08PFS48C is a 1.8V EEPROM with 8388608-bit memory density, suitable for industrial applications. It operates synchronously at up to 33MHz clock frequency and offers 20000 write/erase cycles. With a compact rectangular package style and thin profile, it's ideal for space-constrained designs requiring reliable configuration memory.
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