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XCF02SVOG20C0936

Xilinx

XCF02SVOG20C0936 by Xilinx

Xilinx XCF02SVOG20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade performance with -40 to 85°C temperature range. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminals and gull wing form factor.

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Overview

Unlock the power of advanced technology with the XCF02SVOG20C0936 by Xilinx, a high-quality EEPROM that boasts unparalleled performance and reliability. Manufactured by industry leader Xilinx, this compact and versatile device is perfect for a wide range of applications. With its synchronous operating mode and industrial temperature grade, this EEPROM is designed to deliver exceptional results in any environment. Experience the benefits of seamless integration, fast data transfer, and superior memory density with the XCF02SVOG20C0936. Upgrade your projects today with this top-of-the-line configuration memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with a wide range of devices and systems, offering flexibility in design and integration.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Memory Density: 2097152 bit

With a high memory density, this product can store a large amount of data efficiently, making it ideal for applications that require extensive data storage.

Technical Specifications

EEPROM XCF02SVOG20C0936 attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5024 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

XCF02SVOG20C0936 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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