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XCF02SVOG20CES

Xilinx

XCF02SVOG20CES by Xilinx

Xilinx XCF02SVOG20CES is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device has a small outline package with 0.65mm terminal pitch.

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Nova Conductors

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Texas Native Microelectronics

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Kenton Components

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Overview

Unlock the potential of your electronic devices with the XCF02SVOG20CES EEPROM by Xilinx. Known for their high-quality products, Xilinx delivers reliable solutions for a variety of applications. Whether you're working on industrial automation or consumer electronics, this configuration memory device offers unmatched value and benefits. With its small outline, synchronous operation, and wide temperature range, this EEPROM is designed to meet all your needs. Upgrade your projects with Xilinx and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring a long lifespan.

Surface Mount: YES

Easy to integrate into surface mount technology applications, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Enables synchronized communication with other devices, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level, suitable for a wide range of applications.

No. of Terminals: 20

Provides multiple connection points for seamless integration with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it ideal for industrial environments.

Organization: 2MX1

Organized in a specific structure for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, suitable for a variety of operating conditions.

Terminal Finish: MATTE TIN

Provides a reliable electrical connection and corrosion resistance for extended product life.

Memory Density: 2097152 bit

Offers a large storage capacity for storing configuration data or other critical information.

Technical Specifications

EEPROM XCF02SVOG20CES attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5024 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

XCF02SVOG20CES Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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