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XCF01SVOG20C0936

Xilinx

XCF01SVOG20C0936 by Xilinx

Xilinx XCF01SVOG20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 3.3V, -40 to 85 °C temperature range, suitable for industrial applications. The small outline package has 20 terminals, 0.65mm pitch, and GULL WING form factor for serial configuration memory use.

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Overview

Upgrade your electronic devices with the XCF01SVOG20C0936 by Xilinx, a top-quality EEPROM that offers reliable performance and durability. As a leading manufacturer in the industry, Xilinx ensures that this product meets the highest standards for excellence. Ideal for industrial applications, this EEPROM provides seamless operation in various settings. With its advanced technology and compact design, the XCF01SVOG20C0936 offers customers unmatched value, efficiency, and versatility. Trust Xilinx to deliver innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Enables fast and efficient operation of the EEPROM, ensuring reliable performance in synchronous systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with many electronic devices and systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, allowing the EEPROM to function effectively in a wide range of environments.

Memory Density: 1048576 bit

Offers a large storage capacity, allowing for the storage of a vast amount of data or configurations.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, extending the lifespan of the EEPROM.

Parallel or Serial: SERIAL

Supports serial communication, enabling easy integration with microcontrollers and other serial devices.

Technical Specifications

EEPROM XCF01SVOG20C0936 attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5024 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

XCF01SVOG20C0936 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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