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XCF01SVOG20C0100

Xilinx

XCF01SVOG20C0100 by Xilinx

Xilinx XCF01SVOG20C0100 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory in applications requiring small outline and thin profile packages.

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Overview

Unlock the power of innovation with the XCF01SVOG20C0100 by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality EEPROM technology that is perfect for a wide range of applications. From industrial automation to telecommunications, this configuration memory offers unparalleled reliability and performance. Experience seamless operation with its synchronous mode and compact design, making it the ideal choice for your next project. Trust Xilinx to provide superior products that meet your needs and exceed your expectations. Elevate your designs with the XCF01SVOG20C0100 today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers durability and protection for the EEPROM, making it a reliable choice.

Surface Mount:

YES - This feature allows for easy installation and integration into electronic devices.

Package Shape:

RECTANGULAR - The rectangular shape provides a compact design for space-saving applications.

Operating Mode:

SYNCHRONOUS - The synchronous operation ensures efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V):

3.3 - The 3.3V supply voltage provides compatibility with a wide range of devices.

No. of Terminals:

20 - The 20 terminals allow for versatile connections and functionality.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style enhances portability and reduces footprint in circuit designs.

Maximum Operating Temperature:

85 °C - The high operating temperature range ensures reliability in various environments.

Organization:

1MX1 - The 1MX1 organization offers a high-density memory capacity for storing large amounts of data.

Minimum Operating Temperature:

40 °C - The low operating temperature range allows for use in extreme cold conditions.

Terminal Position:

DUAL - The dual terminal position provides flexibility in board layout and connections.

Maximum Seated Height:

1.19 mm - The low seated height allows for slim and compact device design.

Width:

4.4 mm - The narrow width enables easy integration into tight spaces.

Minimum Supply Voltage (Vsup):

3 V - The 3V minimum supply voltage ensures compatibility with various power sources.

Length:

6.5024 mm - The length of 6.5024mm offers a compact form factor for space-constrained applications.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable performance in harsh operating conditions.

Technology:

CMOS - The CMOS technology provides low power consumption and high-speed operation.

Parallel or Serial:

SERIAL - The serial interface enables fast and efficient data transfer.

Terminal Form:

GULL WING - The gull wing terminal form offers easy soldering and secure connections.

No. of Words:

1048576 words - The high number of words provides ample memory capacity for storing data.

Terminal Pitch:

0.65 mm - The 0.65mm terminal pitch allows for compact spacing of terminals on the device.

No. of Words Code:

1M - The 1M word code indicates a high memory density for storing large amounts of information.

Maximum Supply Voltage (Vsup):

3.6 V - The 3.6V maximum supply voltage ensures safe operation within specified limits.

Memory Density:

1048576 bit - The high memory density of 1048576 bits offers ample storage for data.

Memory IC Type:

CONFIGURATION MEMORY - The EEPROM's configuration memory type is ideal for storing settings and parameters in electronic systems.

Technical Specifications

EEPROM XCF01SVOG20C0100 attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Additional Features:

IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL

JESD-30 Code:

R-PDSO-G20

Length:

6.5024 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

20

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

XCF01SVOG20C0100 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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