Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCF01SVOG20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology device has a small outline package with dual terminal position and matte tin finish.
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This material provides durability and protection for the EEPROM, making it suitable for various industrial applications.
Easy installation and space-saving design for efficient PCB layout.
Enables synchronized data transfers, enhancing overall performance and reliability.
Optimal voltage level for stable operation and power efficiency.
Adequate number of terminals for necessary connections and functionality.
Suitable for industrial environments with high temperature requirements.
Optimal organization for efficient data storage and retrieval.
Can withstand low temperature conditions, ensuring reliability in various environments.
Provides corrosion resistance and a reliable electrical connection.
High memory density for storing a large amount of data.
EEPROM XCF01SVOG20CES attributes and parameters. Explore more EEPROM devices from Xilinx
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
XCF01SVOG20CES Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XCF32PVOG48C
Xilinx
Xilinx XCF32PVOG48C is a 32MX1 EEPROM with 33554432-bit memory density. Operating at 1.8V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, it features synchronous operation and GULL WING terminal form for serial configuration memory needs.
M24C32-WMN6TPP
M24C32-WMN6TPP by STMicroelectronics is an EEPROM with 4Kx8 organization, operating at 2.7V nominal voltage. It features I2C serial bus type, 1.75mm max seated height, and endurance of 1M write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.
25AA02E48T-I/OT
Microchip Technology
25AA02E48T-I/OT by Microchip Technology is a serial EEPROM with 256x8 organization, SPI interface, and 10 MHz clock frequency. It operates at -40 to 85°C, has a supply voltage of 4.5-5.5V, and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in compact designs.
DS2431+
Maxim Integrated
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: RECTANGULAR; Memory Width: 1; Write Protection: HARDWARE;
25LC1024-E/SM
25LC1024-E/SM by Microchip Tech is a 128KX8 EEPROM with 10 MHz clock frequency, SPI serial bus, and 1Mbit memory density. Ideal for automotive applications due to AEC-Q100 screening, -40 to 125 °C operating temp range, and 1000000 write/erase cycles endurance. Offers hardware/software write protection and synchronous operation.
X28HC256JIZ-90
Intersil
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
AT24C256C-MAHL-E
AT24C256C-MAHL-E by Microchip: 32KX8 organization, 262144 bit memory density, 1000000 write/erase cycles. Ideal for industrial applications requiring EEPROM with I2C serial bus and hardware write protection.
25LC256T-I/STRVA
25LC256T-I/STRVA by Microchip Technology is a serial EEPROM with 32Kx8 organization, SPI interface, and 10MHz clock frequency. It operates in industrial temperature range (-40 to 85°C) and offers 1,000,000 write/erase cycles. Ideal for applications requiring reliable non-volatile memory storage in compact designs.
AT93C66B-SSHM-B
Atmel
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
DS28E07+T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Operating Mode: ASYNCHRONOUS;
AT24C512C-XHD-B
AT24C512C-XHD-B by Microchip is a 64KX8 EEPROM with I2C control byte 1010DDDR. It operates at 1 MHz, has 1000000 write/erase cycles endurance, and supports hardware write protection. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact 0.65 mm pitch package.
AT24CM01-SHD-B
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 131072 words;
AT24C64D-XHM-T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 4.4 mm;
AT24C64BN-10SU-2.7
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
CAT25256YI-G
CAT25256YI-G by Onsemi is a 32KX8 EEPROM with SPI serial bus, 262144 bit memory density, and 5 MHz clock frequency. It operates in industrial temperature range (-40 to 85 °C) and has 1000000 Write/Erase Cycles endurance. Ideal for applications requiring reliable non-volatile memory storage in compact designs.
AT24C256C-XHL-T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
BR93H56RF-2CE2
ROHM
BR93H56RF-2CE2 by ROHM is an AEC-Q100 EEPROM with 128x16 organization, operating at 4V. It offers 2048-bit memory density, MICROWIRE serial bus type, and 1000000 write/erase cycles. Ideal for automotive applications requiring reliable data storage in harsh environments.
25LC640-E/SN
25LC640-E/SN by Microchip Technology is an EEPROM with 8KX8 organization, operating at 5V. It offers a max clock frequency of 3 MHz and endurance of 1M Write/Erase cycles. Ideal for automotive applications due to its TS16949 screening level and small outline package style.
AT24C04C-SSHM-B
The Microchip Technology AT24C04C-SSHM-B is a 512x8 EEPROM with I2C serial bus, operating at 1 MHz. It has a supply voltage range of 2.5V to 5.5V and endurance of 1M cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in compact designs with low power consumption.
25LC640AT-I/SN
25LC640AT-I/SN by Microchip Technology is an EEPROM with 8Kx8 organization, SPI serial bus type, and 10 MHz clock frequency. It operates at -40 to 85°C, has a max supply voltage of 5.5V, and offers 1000000 write/erase cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.
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XCF01SVOG20C
The Xilinx XCF01SVOG20C is a 1MX1 NOR type EEPROM with a memory density of 1048576 bits. It operates at a nominal voltage of 3.3V and has an endurance of 20000 write/erase cycles. This configuration memory is commonly used in industrial applications for storing and retrieving data efficiently.
XCF02SVOG20C
Xilinx XCF02SVOG20C is a 2MX1 NOR EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, 0.65mm terminal pitch, and Gull Wing terminals, it's ideal for configuration memory needs in various electronic devices.
XCF04SVO20C
Xilinx XCF04SVO20C is a 3.3V EEPROM with 4MX1 organization, NOR type, and 33MHz clock frequency. Ideal for industrial applications, it offers 4194304-bit memory density in a small outline package with dual terminals and Gull Wing form factor.
XCF04SVOG20C0936
Xilinx XCF04SVOG20C0936 is a 4Mx1 EEPROM with 4194304-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial memory IC comes in a small outline package with dual terminal position and gull wing form factor.
XCF02SVOG20C0936
Xilinx XCF02SVOG20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade performance with -40 to 85°C temperature range. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminals and gull wing form factor.
XCF02SVOG20CES
Xilinx XCF02SVOG20CES is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device has a small outline package with 0.65mm terminal pitch.
XCF01SVOG20C0100
Xilinx XCF01SVOG20C0100 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory in applications requiring small outline and thin profile packages.
XCF01SVOG20C0936
Xilinx XCF01SVOG20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. It operates at 3.3V, -40 to 85 °C temperature range, suitable for industrial applications. The small outline package has 20 terminals, 0.65mm pitch, and GULL WING form factor for serial configuration memory use.
XCF02SVO20C
Xilinx XCF02SVO20C is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, it is ideal for configuration memory in devices requiring low standby current and high endurance.
XCF04SVO20CES
Xilinx XCF04SVO20CES is a 4Mx1 EEPROM with 4194304-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminal position and gull wing form factor.
XCF04SVO20C0936
Xilinx XCF04SVO20C0936 is a 4MX1 EEPROM with a memory density of 4194304 bit. It operates at a nominal voltage of 3.3V and has an industrial temperature grade. This configuration memory IC is commonly used in applications requiring synchronous operation and small form factor packaging.
XCF08PVOG48C
Xilinx XCF08PVOG48C is a 1.8V EEPROM with 8MX1 organization, NOR type, and 8388608-bit memory density. Operating at -40 to 85°C, it's ideal for industrial applications requiring a small outline package with thin profile and shrink pitch. With synchronous operation up to 33MHz, this configuration memory offers reliable performance in various electronic systems.
XCF01SVO20C
Xilinx XCF01SVO20C is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers 20000 Write/Erase Cycles endurance and supports NOR type technology. Ideal for industrial applications requiring configuration memory in a small outline package.
XCF02SVO20C0936
Xilinx XCF02SVO20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it has a small outline package and operates in industrial temperature range. Ideal for configuration memory applications, this CMOS technology device offers serial interface with 0.65mm terminal pitch.
XCF02SVO20CES
Xilinx XCF02SVO20CES is a 2Mx1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it features a small outline package and operates in industrial temperature range. Ideal for configuration memory applications, it offers serial interface and dual terminal position with 0.65mm pitch.
XCF01SVO20C0936
Xilinx XCF01SVO20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and uses CMOS technology. Ideal for industrial applications, this SERIAL memory IC features a 0.65mm terminal pitch in a SMALL OUTLINE package style.
XCF01SVO20CES
Xilinx XCF01SVO20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology chip has a small outline package with dual terminal position and 0.65mm pitch.
XCF08PFSG48C
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 8388608 bit;
XCF08PFS48C
Xilinx XCF08PFS48C is a 1.8V EEPROM with 8388608-bit memory density, suitable for industrial applications. It operates synchronously at up to 33MHz clock frequency and offers 20000 write/erase cycles. With a compact rectangular package style and thin profile, it's ideal for space-constrained designs requiring reliable configuration memory.
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