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XCF01SVOG20CES

Xilinx

XCF01SVOG20CES by Xilinx

Xilinx XCF01SVOG20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology device has a small outline package with dual terminal position and matte tin finish.

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Overview

Enhance the performance of your electronic devices with the XCF01SVOG20CES by Xilinx, a top-quality EEPROM that offers exceptional reliability and durability. Manufactured by Xilinx, a renowned industry leader, this EEPROM is perfect for various applications in the industrial sector. With its advanced technology and high memory density, this configuration memory device ensures seamless operation and optimal functionality. Upgrade your systems with the XCF01SVOG20CES and experience unmatched value and benefits that will elevate your product to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various industrial applications.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, enhancing overall performance and reliability.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level for stable operation and power efficiency.

No. of Terminals: 20

Adequate number of terminals for necessary connections and functionality.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

Organization: 1MX1

Optimal organization for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Can withstand low temperature conditions, ensuring reliability in various environments.

Terminal Finish: MATTE TIN

Provides corrosion resistance and a reliable electrical connection.

Memory Density: 1048576 bit

High memory density for storing a large amount of data.

Technical Specifications

EEPROM XCF01SVOG20CES attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5024 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

XCF01SVOG20CES Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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