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XCF04SVO20CES

Xilinx

XCF04SVO20CES by Xilinx

Xilinx XCF04SVO20CES is a 4Mx1 EEPROM with 4194304-bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85°C. Ideal for configuration memory applications, this serial CMOS device comes in a small outline package with dual terminal position and gull wing form factor.

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Overview

Unlock the power of your devices with the XCF04SVO20CES EEPROM by Xilinx. Known for their top-notch quality and cutting-edge technology, Xilinx has crafted a product that exceeds expectations. This versatile device is perfect for a wide range of applications, offering seamless integration and reliable performance. With a focus on customer satisfaction, Xilinx delivers unmatched value, benefits, and advantages with this innovative product. Upgrade your systems with the XCF04SVO20CES and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the EEPROM, ensuring its durability and longevity.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Enables fast and synchronized data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

Works well within the standard voltage range for most electronic devices.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technology: CMOS

Utilizes low power consumption and high noise immunity.

Parallel or Serial: SERIAL

Enables efficient data transfer in a serial manner.

Memory Density: 4194304 bit

Offers a large memory capacity for storing data.

Memory IC Type: CONFIGURATION MEMORY

Specifically designed for configuration memory applications, ensuring compatibility and reliability.

Technical Specifications

EEPROM XCF04SVO20CES attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5024 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

XCF04SVO20CES Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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