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XCF02SVO20C0936

Xilinx

XCF02SVO20C0936 by Xilinx

Xilinx XCF02SVO20C0936 is a 2MX1 EEPROM with 2097152-bit memory density. Operating at 3.3V, it has a small outline package and operates in industrial temperature range. Ideal for configuration memory applications, this CMOS technology device offers serial interface with 0.65mm terminal pitch.

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Overview

Unlock the power of your devices with the XCF02SVO20C0936 by Xilinx, a top-quality EEPROM that offers unparalleled performance and reliability. Manufactured by Xilinx, a trusted leader in the industry, this configuration memory is perfect for a wide range of applications. With a small outline and thin profile package style, this EEPROM is easy to integrate into any design. Experience seamless operation in industrial environments with its synchronous operating mode and wide temperature range. Trust Xilinx to deliver cutting-edge technology that enhances the functionality of your products. Elevate your designs with the XCF02SVO20C0936 and achieve superior results effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination within the device, leading to reliable performance.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common in many electronic systems, making this EEPROM compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this EEPROM can withstand harsh environmental conditions.

Memory Density: 2097152 bit

With a high memory density of 2097152 bits, this EEPROM can store a large amount of data efficiently.

Technical Specifications

EEPROM XCF02SVO20C0936 attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5024 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

XCF02SVO20C0936 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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