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CAV25256VE-GT3

Onsemi

CAV25256VE-GT3 by Onsemi

CAV25256VE-GT3 by Onsemi is an AEC-Q100 compliant EEPROM with 32KX8 organization, operating at 5V. It features a serial SPI interface, 10 MHz clock frequency, and -40 to 125 °C temperature range. Ideal for automotive applications requiring reliable non-volatile memory in a compact small outline package.

Median Price

$0.824

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,022 parts In-Stock

1+ parts

$0.608

100+ parts

$0.572

1k+ parts

$0.517

10k+ parts

-

4,022

$0.608

$0.572

$0.517

-

Mouser Electronics

USA . 5,285 parts In-Stock

1+ parts

$1.040

100+ parts

$0.910

1k+ parts

$0.883

10k+ parts

-

5,285

$1.040

$0.910

$0.883

-

DigiKey

USA . 2,775 parts In-Stock

1+ parts

$1.040

100+ parts

$0.909

1k+ parts

$0.840

10k+ parts

-

2,775

$1.040

$0.909

$0.840

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Verical

USA . 177,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.524

177,000

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-

$0.524

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 731 parts In-Stock

1+ parts

$0.578

100+ parts

-

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10k+ parts

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731

$0.578

-

-

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Ozdisan Elektronik

Türkiye . 8,224 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

-

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8,224

$0.633

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.021

100+ parts

-

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-

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100

$1.021

-

-

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Demsay Elektronik

Türkiye . 8,134 parts In-Stock

1+ parts

-

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8,134

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Vyrian

USA . 5,320 parts In-Stock

1+ parts

-

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5,320

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-

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Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

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4,500

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Bristol Electronics

USA . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,178 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

-

10k+ parts

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4,178

$0.319

-

-

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Semicontronic

India . 2,214 parts In-Stock

1+ parts

$0.319

100+ parts

$0.311

1k+ parts

$0.309

10k+ parts

-

2,214

$0.319

$0.311

$0.309

-

Corohmni

South Africa . 312 parts In-Stock

1+ parts

$0.535

100+ parts

-

1k+ parts

-

10k+ parts

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312

$0.535

-

-

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Corphita

USA . 694 parts In-Stock

1+ parts

$0.547

100+ parts

-

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694

$0.547

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.021

100+ parts

-

1k+ parts

$0.970

10k+ parts

$0.950

2,000

$1.021

-

$0.970

$0.950

Argo Parts USA

USA . 1,206 parts In-Stock

1+ parts

$1.021

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-

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1,206

$1.021

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Continental Prestige Electronics

USA . 342 parts In-Stock

1+ parts

$1.021

100+ parts

-

1k+ parts

-

10k+ parts

$1.001

342

$1.021

-

-

$1.001

Aztec Data Supply Inc.

USA . 1,852 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

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1,852

$2.970

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Microchip USA

USA . 4,378 parts In-Stock

1+ parts

$6.234

100+ parts

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4,378

$6.234

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RC Electronics

USA . 38,125 parts In-Stock

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38,125

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Perfect Parts

USA . 12,438 parts In-Stock

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12,438

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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SupplyDigital Components

Austria . 6,083 parts In-Stock

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6,083

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TANS Electronics

Latvia . 3,414 parts In-Stock

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3,414

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Kulean Microsystems

USA . 3,272 parts In-Stock

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3,272

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GreenTree Electronics

Israel . 3,025 parts In-Stock

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3,025

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Problanco Electronics

Mexico . 998 parts In-Stock

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998

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Lixinc

USA . 534 parts In-Stock

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534

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 422 parts In-Stock

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422

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Overview

Unlock the power of advanced automotive electronics with the Onsemi CAV25256VE-GT3 EEPROM. Designed with precision by a trusted manufacturer, this compact memory device offers unrivaled reliability and performance in a wide range of applications. From automotive systems to industrial machinery, this versatile EEPROM provides seamless operation and data storage capabilities. Experience the value and benefits of top-tier technology with the CAV25256VE-GT3, where quality meets innovation for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM, ensuring it can withstand harsh environments.

Surface Mount: YES

Allows for easy installation on circuit boards, reducing assembly time and cost.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Enables faster data transfer rates and efficient communication with other synchronous devices.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal voltage, compatible with many electronic systems.

No. of Terminals: 8

Provides necessary connections for interfacing with external circuitry.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for automotive and other industrial applications.

Minimum Operating Temperature: -40 °C

Functions reliably in extreme cold conditions, ensuring consistent performance in various environments.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, enhancing overall performance and reliability.

Serial Bus Type: SPI

Supports SPI communication protocol, enabling fast and efficient data transfer between devices.

Technical Specifications

EEPROM CAV25256VE-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV25256VE-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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