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CAV24C08C5ATR

Onsemi

CAV24C08C5ATR by Onsemi

CAV24C08C5ATR by Onsemi is a 8KX1 EEPROM with I2C serial bus, operating at 3.6V, -40 to 125 °C temperature range. It features 0.4 MHz clock frequency, 0.3mm terminal pitch, and 0.86mm length. Ideal for automotive applications due to its very thin profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 851 parts In-Stock

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Digiode

USA . 89 parts In-Stock

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Native Components

USA . 832 parts In-Stock

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$1.420

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$1.420

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Northwest PG Solutions

USA . 1,890 parts In-Stock

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$1.562

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Ampacity Inc.

Singapore . 1,260 parts In-Stock

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$23.000

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SupplyDigital Components

Austria . 8,171 parts In-Stock

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TANS Electronics

Latvia . 5,461 parts In-Stock

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Kulean Microsystems

USA . 5,439 parts In-Stock

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Problanco Electronics

Mexico . 4,257 parts In-Stock

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Corphita

USA . 1,715 parts In-Stock

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UHIMA Technologies

Türkiye . 839 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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Overview

Elevate your electronics with the premium quality and reliability of the CAV24C08C5ATR by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch performance and cutting-edge technology in their EEPROM products. Ideal for automotive applications, this EEPROM offers unrivaled value and benefits to customers seeking efficient memory solutions. Say goodbye to limitations and hello to seamless operation with the CAV24C08C5ATR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise control and synchronization of data transfers, enhancing reliability and efficiency.

Nominal Supply Voltage / Vsup (V): 3.6

Optimal voltage supply for stable and efficient performance of the EEPROM.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance enables the EEPROM to function reliably in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the EEPROM.

Serial Bus Type: I2C

I2C bus interface allows for easy integration and communication with other devices, making the EEPROM versatile and compatible.

Technical Specifications

EEPROM CAV24C08C5ATR attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

ALSO AVAILABLE 2.5-5.5V WITH 0.1MHZ

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PBGA-B5

Length:

.86 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Maximum Seated Height:

.39 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.6

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.3 mm

Terminal Position:

BOTTOM

Width:

.84 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV24C08C5ATR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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