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CAV25010YE-GT3

Onsemi

CAV25010YE-GT3 by Onsemi

CAV25010YE-GT3 by Onsemi is an AEC-Q100 EEPROM with 128x8 organization, operating at 5V. It features a serial SPI interface, clock frequency of 10MHz, and 1024-bit memory density. Ideal for automotive applications due to its -40 to 125 °C temperature range and compact dimensions of 4.4mm x 3mm.

Median Price

$0.467

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,890 parts In-Stock

1+ parts

$0.550

100+ parts

$0.487

1k+ parts

$0.451

10k+ parts

-

2,890

$0.550

$0.487

$0.451

-

Mouser Electronics

USA . 1,826 parts In-Stock

1+ parts

$0.550

100+ parts

$0.487

1k+ parts

$0.451

10k+ parts

$0.416

1,826

$0.550

$0.487

$0.451

$0.416

Rochester

USA . 36,323 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

$0.307

10k+ parts

$0.274

36,323

-

$0.370

$0.307

$0.274

Verical

USA . 36,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.384

10k+ parts

$0.342

36,323

-

-

$0.384

$0.342

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,407 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,407

$0.288

-

-

-

Flip Electronics

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33,000

-

-

-

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Vyrian

USA . 19,465 parts In-Stock

1+ parts

-

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19,465

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-

-

-

Chip Stock

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

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18,000

-

-

-

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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550

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,491 parts In-Stock

1+ parts

$0.258

100+ parts

-

1k+ parts

-

10k+ parts

-

19,491

$0.258

-

-

-

Semicontronic

India . 19,259 parts In-Stock

1+ parts

$0.258

100+ parts

$0.252

1k+ parts

$0.250

10k+ parts

-

19,259

$0.258

$0.252

$0.250

-

Corphita

USA . 1,953 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

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1,953

$0.273

-

-

-

Corohmni

South Africa . 318 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

-

10k+ parts

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318

$0.303

-

-

-

Microchip USA

USA . 5,182 parts In-Stock

1+ parts

$2.148

100+ parts

-

1k+ parts

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10k+ parts

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5,182

$2.148

-

-

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Aztec Data Supply Inc.

USA . 4,206 parts In-Stock

1+ parts

$2.862

100+ parts

-

1k+ parts

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4,206

$2.862

-

-

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

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100+ parts

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6,000

-

-

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Continental Prestige Electronics

USA . 3,468 parts In-Stock

1+ parts

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3,468

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-

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Problanco Electronics

Mexico . 2,781 parts In-Stock

1+ parts

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100+ parts

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2,781

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SupplyDigital Components

Austria . 2,060 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,060

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-

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TANS Electronics

Latvia . 1,114 parts In-Stock

1+ parts

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1,114

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Kulean Microsystems

USA . 825 parts In-Stock

1+ parts

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825

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

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800

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Argo Parts USA

USA . 752 parts In-Stock

1+ parts

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100+ parts

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752

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UHIMA Technologies

Türkiye . 433 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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433

-

-

-

-

Overview

Enhance your automotive electronics with the high-quality CAV25010YE-GT3 EEPROM by Onsemi. Designed for reliability and performance, this EEPROM offers seamless integration in a compact package. With a wide operating temperature range and AEC-Q100 screening level, it is ideal for demanding automotive applications. Benefit from its fast synchronous operation, low power consumption, and secure data storage capabilities. Trust Onsemi's reputation for excellence and unlock the full potential of your automotive systems with the CAV25010YE-GT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the EEPROM, ensuring it can withstand harsh environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality of the EEPROM, making it suitable for automotive applications where robustness is essential.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer and communication, improving overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V nominal supply voltage allows for compatibility with standard power sources and ensures stable performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the EEPROM can function reliably in high-temperature environments without risk of overheating.

Organization: 128X8

Organized as 128 words of 8 bits each, this EEPROM has a well-structured memory layout that can efficiently store and retrieve data.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40°C, making it suitable for use in a wide range of temperature conditions.

Technology: CMOS

CMOS technology enables low power consumption and high speed operation, making the EEPROM energy-efficient and reliable for various applications.

Parallel or Serial: SERIAL

Serial interface allows for simple and efficient data communication, making it easier to integrate the EEPROM into a variety of electronic systems.

Technical Specifications

EEPROM CAV25010YE-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV25010YE-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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