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24LC64T-I/MSG

Microchip Technology

24LC64T-I/MSG by Microchip Technology

24LC64T-I/MSG by Microchip Technology is an EEPROM with 8KX8 organization, 65536 bit memory density, and 1000000 Write/Erase Cycles endurance. It operates in SERIAL mode with I2C Control Byte of 1010DDDR. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 436 parts In-Stock

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436

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VNN

France . 300 parts In-Stock

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300

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Distributors (Availability)

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Corohmni

South Africa . 349 parts In-Stock

1+ parts

$2.602

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349

$2.602

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$3.354

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$3.186

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$3.186

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200

$3.354

$3.186

$3.186

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Aztec Data Supply Inc.

USA . 4,874 parts In-Stock

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$4.940

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$4.940

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AZTECH Wire

Italy . 436 parts In-Stock

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$6.128

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436

$6.128

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Semicontronic

India . 438 parts In-Stock

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$22.000

100+ parts

$21.450

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$21.340

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438

$22.000

$21.450

$21.340

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Kepictronics

USA . 10,800 parts In-Stock

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10,800

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West Coast Incorporated

USA . 5,764 parts In-Stock

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Continental Prestige Electronics

USA . 3,169 parts In-Stock

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Argo Parts USA

USA . 1,843 parts In-Stock

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1,843

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock endless possibilities with the 24LC64T-I/MSG EEPROM by Microchip Technology. Designed with precision and reliability in mind, this product offers unparalleled value and benefits for a wide range of applications. From industrial automation to consumer electronics, this small outline, thin profile memory device provides 8Kx8 organization and 1000000 write/erase cycles, ensuring long-lasting performance and data integrity. Trust Microchip Technology for quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring a long lifespan.

Surface Mount: YES

The surface-mount feature makes it easy to integrate this EEPROM into various electronic devices, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package allows for efficient placement on circuit boards, optimizing layout and design.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures reliable and accurate data transfer, making this EEPROM suitable for demanding applications.

Nominal Supply Voltage / Vsup (V): 5

This higher nominal supply voltage provides stable power to the EEPROM, enhancing performance and reliability.

Power Supplies (V): 3/5

The multiple power supply options allow for flexibility in different voltage environments, increasing compatibility.

No. of Terminals: 8

The EEPROM with 8 terminals offers easy connectivity and interface with other components, simplifying integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space and allows for high-density mounting, ideal for compact devices with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures stability and reliability in a variety of operating environments.

Organization: 8KX8

The 8KX8 organization provides a balance between capacity and speed, meeting the demands of various applications efficiently.

Technical Specifications

EEPROM 24LC64T-I/MSG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC64T-I/MSG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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