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24LC16BT-I/SNG

Microchip Technology

24LC16BT-I/SNG by Microchip Technology

24LC16BT-I/SNG by Microchip Technology is an EEPROM with 2KX8 organization, operating at 5V. It offers hardware write protection and endurance of 1M cycles. Suitable for industrial applications, it has a serial I2C bus type and operates at a max clock frequency of 0.4 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 320,920 parts In-Stock

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Semi Source

USA . 3,172 parts In-Stock

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3,172

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Vyrian

USA . 1,486 parts In-Stock

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1,486

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VNN

France . 796 parts In-Stock

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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Ampacity Inc.

Singapore . 557 parts In-Stock

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$2.000

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557

$2.000

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Corohmni

South Africa . 1,027 parts In-Stock

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$3.093

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$3.093

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$3.738

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$3.551

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$3.551

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20

$3.738

$3.551

$3.551

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Aztec Data Supply Inc.

USA . 2,688 parts In-Stock

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$5.280

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$5.280

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AZTECH Wire

Italy . 233 parts In-Stock

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$5.518

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233

$5.518

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Semicontronic

India . 727 parts In-Stock

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$10.000

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$9.750

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$9.700

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727

$10.000

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$9.700

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Perfect Parts

USA . 6,028 parts In-Stock

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Fulton Briggs Corp.

USA . 5,751 parts In-Stock

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Continental Prestige Electronics

USA . 2,225 parts In-Stock

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Argo Parts USA

USA . 1,974 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Modulus Dynamics

Lithuania . 200 parts In-Stock

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200

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Overview

Unlock the power of reliable data storage with the 24LC16BT-I/SNG by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality EEPROM products that are perfect for a wide range of applications. With a focus on durability and performance, this EEPROM offers customers the value of long-lasting memory solutions with write/erase cycles up to 1,000,000 times. Experience peace of mind knowing your data is safe and secure, whether you're in industrial settings or consumer electronics. Choose Microchip Technology for trusted quality and exceptional performance.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this EEPROM a cost-effective and lightweight option.

Surface Mount : YES

The surface mount feature allows for easy and convenient installation of this EEPROM on circuit boards.

Package Shape : RECTANGULAR

The rectangular package shape provides a standard design that can easily fit into various electronic devices.

Operating Mode : SYNCHRONOUS

The synchronous operating mode ensures precise and coordinated data transfer for reliable performance.

Nominal Supply Voltage / Vsup (V) : 5

The nominal supply voltage of 5V offers compatibility with a wide range of systems and applications.

Power Supplies (V) : 2/5

The availability of both 2V and 5V power supplies adds flexibility to the operation of this EEPROM.

No. of Terminals : 8

With 8 terminals, this EEPROM can easily connect to other components in a system for seamless integration.

Package Style (Meter) : SMALL OUTLINE

The small outline package style makes this EEPROM space-efficient and ideal for compact electronic devices.

Maximum Operating Temperature : 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in challenging environments.

Organization : 2KX8

The organization of 2KX8 allows for efficient storage and retrieval of data in this EEPROM.

Minimum Operating Temperature : -40 °C

The low minimum operating temperature of -40°C enables this EEPROM to function in extreme cold conditions.

Terminal Finish : Matte Tin (Sn)

The matte tin terminal finish provides good conductivity and durability for long-lasting use of this EEPROM.

I2C Control Byte : 1010MMMR

The I2C control byte 1010MMMR ensures compatibility with I2C communication protocols for seamless data transfer.

Terminal Position : DUAL

The dual terminal position offers flexibility in connecting this EEPROM to other components in a system.

Write Protection : HARDWARE

The hardware write protection feature enhances data security and prevents accidental data loss in this EEPROM.

Maximum Seated Height : 1.75 mm

The maximum seated height of 1.75mm allows for easy integration of this EEPROM in tightly spaced electronic devices.

Maximum Clock Frequency (fCLK) : 0.4 MHz

The high maximum clock frequency of 0.4 MHz enables fast data transfer rates in this EEPROM.

Width : 3.91 mm

The narrow width of 3.91mm makes this EEPROM suitable for applications with limited space constraints.

Minimum Supply Voltage (Vsup) : 2.5 V

The minimum supply voltage of 2.5V ensures efficient power consumption in this EEPROM.

Maximum Time At Peak Reflow Temperature (s) : 40

The maximum time of 40 seconds at peak reflow temperature allows for safe and reliable soldering of this EEPROM.

Peak Reflow Temperature °C : 260

The high peak reflow temperature of 260°C ensures secure solder joints for the EEPROM during assembly.

Length : 4.9 mm

The compact length of 4.9mm makes this EEPROM suitable for small electronic devices without compromising functionality.

Temperature Grade : INDUSTRIAL

The industrial temperature grade of this EEPROM ensures reliable operation in harsh industrial environments.

Technology : CMOS

The CMOS technology used in this EEPROM offers low power consumption and high performance for efficient data storage.

Parallel or Serial : SERIAL

The serial communication interface enables efficient data transfer and storage capabilities in this EEPROM.

Terminal Form : GULL WING

The gull wing terminal form provides secure connections and easy soldering of this EEPROM to circuit boards.

Maximum Supply Current : 3 mA

The low maximum supply current of 3mA minimizes power consumption and extends the lifespan of this EEPROM.

No. of Words : 2048 words

With a capacity of 2048 words, this EEPROM can store a significant amount of data for various applications.

Memory Width : 8

The memory width of 8 bits allows this EEPROM to efficiently store and retrieve data in byte-sized chunks.

Minimum Data Retention Time : 200

The minimum data retention time of 200 years ensures long-term data integrity and reliability in this EEPROM.

Terminal Pitch : 1.27 mm

The narrow terminal pitch of 1.27mm allows for high-density mounting of this EEPROM on PCBs.

No. of Words Code : 2K

The 2K words code indicates the storage capacity of this EEPROM, making it suitable for various data storage requirements.

Maximum Supply Voltage (Vsup) : 5.5 V

The maximum supply voltage of 5.5V ensures safe operation of this EEPROM within specified voltage limits.

Endurance : 1000000 Write/Erase Cycles

The high endurance rating of 1,000,000 write/erase cycles ensures durability and reliability of this EEPROM for frequent data updates.

Serial Bus Type : I2C

The I2C serial bus type provides a standardized communication protocol for seamless integration of this EEPROM in I2C systems.

Maximum Write Cycle Time (tWC) : 5 ms

The fast maximum write cycle time of 5ms ensures quick data storage and retrieval in this EEPROM.

Memory Density : 16384 bit

The high memory density of 16,384 bits offers ample storage capacity for data-intensive applications in this EEPROM.

Memory IC Type : EEPROM

The EEPROM memory IC type provides non-volatile data storage, making it suitable for applications requiring persistent data retention.

Maximum Standby Current : 0.000001 Amp

The ultra-low maximum standby current of 0.000001 Amp ensures minimal power consumption during standby mode, enhancing energy efficiency.

Technical Specifications

EEPROM 24LC16BT-I/SNG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.91 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC16BT-I/SNG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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