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24LC64-I/PG

Microchip Technology

24LC64-I/PG by Microchip Technology

24LC64-I/PG by Microchip Technology is an EEPROM with 8KX8 organization, operating at 5V. It features a max clock frequency of 0.4 MHz and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 1,867 parts In-Stock

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1,867

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Vyrian

USA . 1,269 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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NexGen Digital

USA . 149 parts In-Stock

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149

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Ampacity Inc.

Singapore . 855 parts In-Stock

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$3.000

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855

$3.000

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Corohmni

South Africa . 1,238 parts In-Stock

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$5.511

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Aztec Data Supply Inc.

USA . 2,691 parts In-Stock

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$5.530

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$5.530

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AZTECH Wire

Italy . 872 parts In-Stock

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$7.253

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872

$7.253

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Semicontronic

India . 325 parts In-Stock

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$29.000

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$28.275

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$28.130

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325

$29.000

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Kepictronics

USA . 10,800 parts In-Stock

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Argo Parts USA

USA . 4,920 parts In-Stock

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Continental Prestige Electronics

USA . 1,402 parts In-Stock

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West Coast Incorporated

USA . 334 parts In-Stock

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334

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock a world of endless possibilities with the 24LC64-I/PG EEPROM by Microchip Technology. Known for their top-notch quality and reliability, Microchip Technology delivers cutting-edge technology in a compact PLASTIC/EPOXY package. Ideal for industrial applications, this EEPROM offers 8KX8 organization, 8192 words, and 1000000 Write/Erase Cycles ensuring data integrity and longevity. Experience seamless integration and enhanced performance with the 24LC64-I/PG, designed to meet your evolving needs effortlessly. Elevate your projects with Microchip Technology's innovative solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various operating conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures reliable and synchronized data transfers, enhancing the overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures stable and consistent power supply for the EEPROM.

Memory Density: 65536 bit

With a high memory density, this EEPROM can store a large amount of data efficiently, making it ideal for various applications.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating ensures long-lasting performance and reliability for frequent read and write operations on the EEPROM.

Serial Bus Type: I2C

Being compatible with the I2C serial bus type allows for easy integration and communication with other devices, simplifying system design.

Technical Specifications

EEPROM 24LC64-I/PG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC64-I/PG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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