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24LC64-I/SMG

Microchip Technology

24LC64-I/SMG by Microchip Technology

24LC64-I/SMG by Microchip Technology is an 8KX8 EEPROM with 1000000 Write/Erase Cycles. It operates at a max clock frequency of 0.4 MHz and has a memory density of 65536 bit. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$2.440

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 671 parts In-Stock

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$2.440

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671

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VNN

France . 4,897 parts In-Stock

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Vyrian

USA . 153 parts In-Stock

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153

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Prism Electronics

USA . 27 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,134 parts In-Stock

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$2.980

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$2.980

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Corohmni

South Africa . 9 parts In-Stock

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$5.852

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9

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Semicontronic

India . 372 parts In-Stock

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$6.000

100+ parts

$5.850

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$5.820

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372

$6.000

$5.850

$5.820

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Ampacity Inc.

Singapore . 417 parts In-Stock

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$11.000

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417

$11.000

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AZTECH Wire

Italy . 801 parts In-Stock

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$13.298

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801

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RGB Technical Solutions

Ukraine . 6,145 parts In-Stock

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Continental Prestige Electronics

USA . 3,219 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 138 parts In-Stock

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Perfect Parts

USA . 30 parts In-Stock

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Overview

Unlock endless possibilities with the 24LC64-I/SMG by Microchip Technology. This high-quality EEPROM offers unparalleled reliability and performance in a compact, surface-mount package. Ideal for industrial applications, this memory device provides secure data storage with hardware write protection, ensuring your information stays safe. Experience the convenience of a low standby current and fast write cycle time, making it the perfect choice for your next project. Embrace innovation with the Microchip 24LC64-I/SMG and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the EEPROM package durable and resistant to damage, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enables precise and efficient data transfer, enhancing the overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and stable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this EEPROM is suitable for industrial applications where high temperatures may be encountered.

Write Protection: HARDWARE

Hardware write protection enhances data security by preventing unauthorized write access, ensuring the integrity of stored information.

Memory Density: 65536 bit

With a high memory density of 65536 bits, this EEPROM offers ample storage capacity for data-intensive applications.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating of 1000000 write/erase cycles ensures reliable data retention and longevity of the EEPROM.

Technical Specifications

EEPROM 24LC64-I/SMG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.245 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.23 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC64-I/SMG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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