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M95512-DFMN6TP

STMicroelectronics

M95512-DFMN6TP by STMicroelectronics

STMicroelectronics M95512-DFMN6TP is a 64KX8 EEPROM with 1.8V nominal voltage, SPI serial bus type, and 1000000 write/erase cycles endurance. It operates at -40 to 85 °C, suitable for industrial applications requiring reliable non-volatile memory storage in compact designs.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 101 parts In-Stock

1+ parts

$0.902

100+ parts

$0.788

1k+ parts

$0.728

10k+ parts

$0.685

101

$0.902

$0.788

$0.728

$0.685

Mouser Electronics

USA . 4,704 parts In-Stock

1+ parts

$1.150

100+ parts

$1.010

1k+ parts

$0.929

10k+ parts

$0.855

4,704

$1.150

$1.010

$0.929

$0.855

DigiKey

USA . 3,824 parts In-Stock

1+ parts

$1.150

100+ parts

$1.005

1k+ parts

$0.929

10k+ parts

$0.863

3,824

$1.150

$1.005

$0.929

$0.863

Newark

USA . 2,463 parts In-Stock

1+ parts

$1.290

100+ parts

$1.150

1k+ parts

$0.926

10k+ parts

-

2,463

$1.290

$1.150

$0.926

-

Element14

Singapore . 101 parts In-Stock

1+ parts

$1.540

100+ parts

$1.300

1k+ parts

$1.240

10k+ parts

$1.180

101

$1.540

$1.300

$1.240

$1.180

Arrow

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.619

15,000

-

-

-

$0.619

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.554

7,500

-

-

-

$0.554

Chip1Stop

Japan . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,938 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

-

10k+ parts

-

3,938

$0.205

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.820

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$0.820

-

-

-

ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Anansix

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,220

-

-

-

-

Vyrian

USA . 1,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,172

-

-

-

-

Chip Stock

USA . 1,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,103

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,928 parts In-Stock

1+ parts

$0.184

100+ parts

$0.179

1k+ parts

$0.178

10k+ parts

-

1,928

$0.184

$0.179

$0.178

-

Ampacity Inc.

Singapore . 1,152 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

1,152

$0.184

-

-

-

Corphita

USA . 2,526 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

2,526

$0.194

-

-

-

Continental Prestige Electronics

USA . 2,429 parts In-Stock

1+ parts

$0.788

100+ parts

$0.625

1k+ parts

$0.591

10k+ parts

-

2,429

$0.788

$0.625

$0.591

-

Argo Parts USA

USA . 615 parts In-Stock

1+ parts

$0.820

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$0.820

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.820

100+ parts

$0.779

1k+ parts

$0.740

10k+ parts

$0.730

100

$0.820

$0.779

$0.740

$0.730

Corohmni

South Africa . 16 parts In-Stock

1+ parts

$3.324

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$3.324

-

-

-

IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

$4.815

10k+ parts

-

1,476

$5.350

-

$4.815

-

Aztec Data Supply Inc.

USA . 4,303 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

4,303

$5.510

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.083

100+ parts

$5.779

1k+ parts

$5.779

10k+ parts

-

3,000

$6.083

$5.779

$5.779

-

MKK Technologies

India . 888 parts In-Stock

1+ parts

$10.060

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$10.060

-

-

-

DigiPath Technology Company

USA . 888 parts In-Stock

1+ parts

$10.060

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$10.060

-

-

-

Perfect Parts

USA . 30,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,800

-

-

-

-

Lixinc

USA . 9,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,082

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$6.396

1k+ parts

-

10k+ parts

-

20

-

$6.396

-

-

Overview

Discover the M95512-DFMN6TP by STMicroelectronics, a top-quality EEPROM that offers unparalleled reliability and performance. As a leading manufacturer in the industry, STMicroelectronics ensures that their products meet the highest standards. This versatile EEPROM is ideal for a wide range of applications, from industrial to consumer electronics. With its durable construction and advanced features, this product provides exceptional value and benefits to customers, making it the perfect choice for your next project. Trust STMicroelectronics for all your memory needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the EEPROM, making it a reliable choice.

Surface Mount:

YES - Allows for easy and convenient installation on circuit boards.

Package Shape:

RECTANGULAR - Maximizes space efficiency for compact electronic devices.

Operating Mode:

SYNCHRONOUS - Ensures efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V):

1.8 - Compatible with low-power applications, making it energy-efficient.

Power Supplies (V):

1.8/5 - Provides flexibility in power options for different system requirements.

No. of Terminals:

8 - Simplifies connectivity and integration with other components.

Package Style (Meter):

SMALL OUTLINE - Ideal for applications with limited space constraints.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments with varying temperature conditions.

Organization:

64KX8 - Offers a large memory capacity for storing data.

Minimum Operating Temperature:

40 °C - Ensures reliable performance in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Enhances durability and longevity of the terminal connections.

Terminal Position:

DUAL - Provides redundancy and reliability in terminal connections.

Write Protection:

HARDWARE/SOFTWARE - Offers multiple levels of data security to prevent accidental data loss.

Maximum Seated Height:

1.75 mm - Enables low-profile designs for space-constrained applications.

Maximum Clock Frequency (fCLK):

5 MHz - Supports high-speed data transfer for quick processing.

Width:

3.9 mm - Compact design for space-efficient integration.

Minimum Supply Voltage (Vsup):

1.7 V - Ensures compatibility with low-voltage systems.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for safe and efficient reflow soldering during manufacturing.

Peak Reflow Temperature °C:

260 - Ensures reliable solder connections for long-term use.

Length:

4.9 mm - Compact form factor for space-saving designs.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with harsh environmental conditions.

Technology:

CMOS - Offers low power consumption and high speed operation.

Parallel or Serial:

SERIAL - Facilitates serial communication for efficient data transfer.

Terminal Form:

GULL WING - Provides secure and reliable terminal connections.

Maximum Supply Current:

2.5 mA - Low current consumption for energy-efficient operation.

No. of Words:

65536 words - Offers large memory capacity for data storage.

Memory Width:

8 - Wide memory interface for efficient data processing.

Minimum Data Retention Time:

40 - Ensures data integrity and reliability over time.

Terminal Pitch:

1.27 mm - Standard pitch for easy integration on circuit boards.

No. of Words Code:

64K - Identifies the memory capacity for easy reference.

Maximum Supply Voltage (Vsup):

5.5 V - Provides a wide range of voltage compatibility for diverse applications.

Endurance:

1000000 Write/Erase Cycles - Ensures long-term reliability and durability for frequent read/write operations.

Serial Bus Type:

SPI - Supports serial communication for efficient data transfer.

Memory Density:

524288 bit - Offers high memory density for storing large amounts of data.

Memory IC Type:

EEPROM - Ideal for non-volatile data storage in electronic devices.

Maximum Standby Current:

0.000003 Amp - Extremely low standby current consumption for energy-efficient operation.

Technical Specifications

EEPROM M95512-DFMN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95512-DFMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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