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24AA256-I/SNG

Microchip Technology

24AA256-I/SNG by Microchip Technology

24AA256-I/SNG by Microchip Technology is an EEPROM with 32KX8 organization, operating at -40 to 85 °C. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,389 parts In-Stock

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Vyrian

USA . 1,312 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 571 parts In-Stock

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$3.469

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571

$3.469

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Aztec Data Supply Inc.

USA . 1,498 parts In-Stock

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$4.640

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$4.640

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$5.580

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$5.301

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$5.301

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100

$5.580

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$5.301

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AZTECH Wire

Italy . 703 parts In-Stock

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$9.149

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703

$9.149

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Ampacity Inc.

Singapore . 597 parts In-Stock

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$11.000

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597

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Semicontronic

India . 933 parts In-Stock

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$16.000

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$15.600

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$15.520

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933

$16.000

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$15.520

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RGB Technical Solutions

Ukraine . 3,761 parts In-Stock

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Argo Parts USA

USA . 1,793 parts In-Stock

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Continental Prestige Electronics

USA . 495 parts In-Stock

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495

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Bastille Electronics

Australia . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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Overview

Unlock endless possibilities with the 24AA256-I/SNG EEPROM by Microchip Technology. With a reputation for high-quality manufacturing, this device offers unparalleled reliability and performance. Ideal for a wide range of applications, this EEPROM provides valuable benefits such as fast data transfer, low power consumption, and secure write protection. Experience seamless integration and enhanced functionality with the 24AA256-I/SNG, setting a new standard for memory IC technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this EEPROM lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB, making this EEPROM suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standard form factor, making it compatible with existing layouts and designs.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures accurate and efficient data transfer, making this EEPROM a reliable choice for high-performance systems.

Power Supplies (V): 2/5

With a wide range of power supply options, this EEPROM can be used in different voltage environments, providing flexibility in design.

No. of Terminals: 8

The 8 terminals offer a simple and straightforward interface, making it easy to integrate this EEPROM into various circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space, making this EEPROM suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can withstand harsh environmental conditions, ensuring reliability in extreme situations.

Organization: 32KX8

The 32Kx8 organization provides a large memory capacity, making this EEPROM suitable for storing a significant amount of data.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this EEPROM to function in cold environments, expanding its potential applications.

Technical Specifications

EEPROM 24AA256-I/SNG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Reverse Pinout:

NO

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA256-I/SNG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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