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24AA02T-I/OTG

Microchip Technology

24AA02T-I/OTG by Microchip Technology

24AA02T-I/OTG by Microchip Technology is a 256x8 EEPROM with I2C control byte for hardware write protection. Operating at 2.5V, it offers 1000000 write/erase cycles and has a memory density of 2048 bits. Ideal for industrial applications requiring low profile, small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 100,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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100,500

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Vyrian

USA . 1,544 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,544

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VNN

France . 384 parts In-Stock

1+ parts

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100+ parts

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384

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Nova Conductors

Japan . 32 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,080 parts In-Stock

1+ parts

$2.967

100+ parts

-

1k+ parts

-

10k+ parts

-

2,080

$2.967

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-

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Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$4.554

100+ parts

$4.326

1k+ parts

$4.326

10k+ parts

-

61

$4.554

$4.326

$4.326

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$5.518

100+ parts

-

1k+ parts

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10k+ parts

-

368

$5.518

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-

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Ampacity Inc.

Singapore . 1,154 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,154

$7.000

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-

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AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$15.585

100+ parts

-

1k+ parts

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10k+ parts

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316

$15.585

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Semicontronic

India . 1,573 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

10k+ parts

-

1,573

$20.000

$19.500

$19.400

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Continental Prestige Electronics

USA . 2,261 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,261

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RGB Technical Solutions

Ukraine . 1,840 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,840

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-

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Argo Parts USA

USA . 388 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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388

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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100

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Overview

Experience seamless data storage and retrieval with the 24AA02T-I/OTG EEPROM by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-notch quality and reliability in all their products. Ideal for industrial applications, this compact memory device offers 256 words of storage with 1000000 write/erase cycles, ensuring long-term data retention and durability. The I2C serial bus interface simplifies communication, while the hardware write protection feature enhances security. Trust Microchip Technology to deliver innovative solutions that meet your data storage needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This makes the product lightweight and durable, ideal for portable devices.

Surface Mount

YES - Allows for easy integration onto circuit boards, saving space and reducing assembly time.

Package Shape

RECTANGULAR - Provides a compact form factor, suitable for tight layouts in electronic devices.

Operating Mode

SYNCHRONOUS - Ensures fast and accurate data transfers, essential for real-time applications.

Nominal Supply Voltage / Vsup (V)

2.5 - Works efficiently within a common voltage range, making it compatible with many systems.

Power Supplies (V)

2/5 - Offers flexibility in power options, accommodating different requirements.

No. of Terminals

5 - Simplifies the connection process, reducing the likelihood of errors during installation.

Package Style (Meter)

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - Enables a space-saving design, suitable for compact electronic devices.

Maximum Operating Temperature

85 °C - Ensures reliability in a range of environmental conditions, making it versatile and durable.

Organization

256X8 - Provides sufficient memory capacity for storing data, suitable for various applications.

Minimum Operating Temperature

40 °C - Maintains functionality even in extreme temperatures, ensuring consistent performance.

Terminal Finish

MATTE TIN - Enhances the product's conductivity, optimizing signal transmission.

I2C Control Byte

1010XXXR - Allows for easy interfacing with other components, facilitating efficient communication.

Terminal Position

DUAL - Provides a secure and stable connection, minimizing the risk of disconnection.

Write Protection

HARDWARE - Safeguards data from accidental alteration, ensuring data integrity and security.

Maximum Seated Height

1.45 mm - Low-profile design fits in tight spaces, suitable for slim devices.

Maximum Clock Frequency (fCLK)

0.1 MHz - Supports fast data transfer rates, crucial for high-performance applications.

Width

1.55 mm - Compact dimensions enable integration into small devices without sacrificing functionality.

Minimum Supply Voltage (Vsup)

1.7 V - Operates efficiently even with low power input, conserving energy.

Peak Reflow Temperature °C

260 - Withstands high-temperature reflow soldering processes, ensuring reliable assembly.

Length

2.9 mm - Compact size allows for easy integration into electronic systems with limited space.

Temperature Grade

INDUSTRIAL - Designed for use in industrial environments, ensuring reliability in harsh conditions.

Technology

CMOS - Utilizes low power consumption technology, prolonging battery life in portable devices.

Parallel or Serial

SERIAL - Facilitates sequential data access, essential for efficient read/write operations.

Terminal Form

GULL WING - Provides a secure and stable connection, minimizing the risk of signal loss or interference.

Maximum Supply Current

3 mA - Efficient power consumption, reducing energy costs and extending battery life.

No. of Words

256 words - Offers ample storage capacity for data, suitable for various applications.

Memory Width

8 - Accommodates data in standard byte sizes, simplifying data processing and storage.

Minimum Data Retention Time

200 - Ensures data integrity over an extended period, suitable for long-term storage.

Terminal Pitch

0.95 mm - Provides a secure and stable connection, reducing the risk of signal loss or interference.

No. of Words Code

256 - Enables efficient addressing of memory locations, simplifying data retrieval.

Maximum Supply Voltage (Vsup)

5.5 V - Operates within a wide voltage range, accommodating various power sources.

Endurance

1000000 Write/Erase Cycles - Offers a high number of read/write cycles, ensuring long-lasting reliability.

Serial Bus Type

I2C - Supports a popular communication protocol, facilitating compatibility with other devices.

Maximum Write Cycle Time (tWC)

5 ms - Ensures fast data writing speeds, essential for time-sensitive applications.

Memory Density

2048 bit - Provides a high storage capacity, suitable for storing large amounts of data.

Memory IC Type

EEPROM - Offers non-volatile memory storage, retaining data even when powered off.

Maximum Standby Current

0.000001 Amp - Low standby power consumption, enhancing energy efficiency.

Technical Specifications

EEPROM 24AA02T-I/OTG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XXXR

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.55 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24AA02T-I/OTG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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