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CAV25256YE-GT3

Onsemi

CAV25256YE-GT3 by Onsemi

CAV25256YE-GT3 by Onsemi is an AEC-Q100 EEPROM with 32KX8 organization, operating at 5V. It features a serial SPI interface, 10 MHz clock frequency, and -40 to 125 °C temperature range. Ideal for automotive applications requiring reliable non-volatile memory in a compact 0.65 mm pitch package.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,960 parts In-Stock

1+ parts

$1.160

100+ parts

$0.999

1k+ parts

$0.923

10k+ parts

$0.734

3,960

$1.160

$0.999

$0.923

$0.734

DigiKey

USA . 2,544 parts In-Stock

1+ parts

$1.160

100+ parts

$1.012

1k+ parts

$0.935

10k+ parts

-

2,544

$1.160

$1.012

$0.935

-

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

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3

$4.290

-

-

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Flip Electronics (Authorized)

USA . 17,598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17,598

-

-

-

-

Rochester

USA . 10,942 parts In-Stock

1+ parts

-

100+ parts

$0.792

1k+ parts

$0.657

10k+ parts

$0.586

10,942

-

$0.792

$0.657

$0.586

Verical

USA . 8,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.821

10k+ parts

$0.732

8,310

-

-

$0.821

$0.732

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 546 parts In-Stock

1+ parts

$0.616

100+ parts

-

1k+ parts

-

10k+ parts

-

546

$0.616

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.776

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.776

-

-

-

Chip Stock

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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60,000

-

-

-

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Flip Electronics

USA . 17,598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,598

-

-

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Vyrian

USA . 7,339 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,339

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,612 parts In-Stock

1+ parts

$0.550

100+ parts

$0.536

1k+ parts

$0.534

10k+ parts

-

7,612

$0.550

$0.536

$0.534

-

Ampacity Inc.

Singapore . 7,309 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

7,309

$0.550

-

-

-

Corphita

USA . 1,027 parts In-Stock

1+ parts

$0.583

100+ parts

-

1k+ parts

-

10k+ parts

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1,027

$0.583

-

-

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Corohmni

South Africa . 123 parts In-Stock

1+ parts

$0.648

100+ parts

-

1k+ parts

-

10k+ parts

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123

$0.648

-

-

-

Continental Prestige Electronics

USA . 6,089 parts In-Stock

1+ parts

$0.776

100+ parts

-

1k+ parts

-

10k+ parts

$0.760

6,089

$0.776

-

-

$0.760

Argo Parts USA

USA . 321 parts In-Stock

1+ parts

$0.776

100+ parts

-

1k+ parts

-

10k+ parts

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321

$0.776

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.776

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.776

-

-

-

Aztec Data Supply Inc.

USA . 513 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$2.010

-

-

-

Microchip USA

USA . 4,188 parts In-Stock

1+ parts

$5.937

100+ parts

-

1k+ parts

-

10k+ parts

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4,188

$5.937

-

-

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SupplyDigital Components

Austria . 7,717 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,717

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Problanco Electronics

Mexico . 5,271 parts In-Stock

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5,271

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TANS Electronics

Latvia . 4,109 parts In-Stock

1+ parts

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4,109

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Kulean Microsystems

USA . 3,206 parts In-Stock

1+ parts

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3,206

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Authorized Procurement Solutions

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,780

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GreenTree Electronics

Israel . 803 parts In-Stock

1+ parts

-

100+ parts

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803

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UHIMA Technologies

Türkiye . 627 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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627

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-

Overview

Unlock the power of reliable data storage with the CAV25256YE-GT3 by Onsemi. This EEPROM offers unparalleled quality and performance, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for automotive applications, this compact and versatile memory device provides customers with the value and benefits they need for their projects. Trust in Onsemi to deliver cutting-edge technology that meets your storage needs with ease. Elevate your designs with the CAV25256YE-GT3 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, which can improve overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply systems, making integration into existing designs seamless.

Maximum Operating Temperature: 125 °C

Suitable for automotive applications where high temperature tolerance is required.

No. of Words: 32768 words

Offers a large memory capacity for storing data and settings in a compact form factor.

Memory Width: 8

Provides a standard 8-bit data width for efficient data transfer and processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable operation in various environments.

Serial Bus Type: SPI

Uses SPI communication protocol for high-speed data transfers and easy integration with microcontrollers.

Technical Specifications

EEPROM CAV25256YE-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

10 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV25256YE-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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