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CAV24C64YE-GT3

Onsemi

CAV24C64YE-GT3 by Onsemi

CAV24C64YE-GT3 by Onsemi is an EEPROM with 64KX1 organization, operating at 5V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C temperature range.

Median Price

$0.598

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,381 parts In-Stock

1+ parts

$0.780

100+ parts

$0.680

1k+ parts

-

10k+ parts

-

7,381

$0.780

$0.680

-

-

DigiKey

USA . 3,383 parts In-Stock

1+ parts

$0.780

100+ parts

$0.679

1k+ parts

$0.628

10k+ parts

-

3,383

$0.780

$0.679

$0.628

-

Chip1Stop

Japan . 1,948 parts In-Stock

1+ parts

$4.050

100+ parts

$1.270

1k+ parts

$0.875

10k+ parts

-

1,948

$4.050

$1.270

$0.875

-

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.387

9,000

-

-

-

$0.387

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.415

3,000

-

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-

$0.415

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.385

3,000

-

-

-

$0.385

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,118 parts In-Stock

1+ parts

$0.674

100+ parts

-

1k+ parts

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1,118

$0.674

-

-

-

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$0.766

100+ parts

-

1k+ parts

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68

$0.766

-

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Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

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9,000

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.754

6,000

-

-

-

$0.754

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.540

3,000

-

-

-

$0.540

Vyrian

USA . 2,350 parts In-Stock

1+ parts

-

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2,350

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Chip Stock

USA . 185 parts In-Stock

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185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,503 parts In-Stock

1+ parts

$0.323

100+ parts

-

1k+ parts

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10k+ parts

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2,503

$0.323

-

-

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Corphita

USA . 1,514 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

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10k+ parts

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1,514

$0.639

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$0.710

100+ parts

-

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10k+ parts

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478

$0.710

-

-

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Continental Prestige Electronics

USA . 6,835 parts In-Stock

1+ parts

$0.766

100+ parts

-

1k+ parts

-

10k+ parts

$0.750

6,835

$0.766

-

-

$0.750

Argo Parts USA

USA . 2,936 parts In-Stock

1+ parts

$0.766

100+ parts

-

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10k+ parts

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2,936

$0.766

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Netroflash

USA . 500 parts In-Stock

1+ parts

$0.766

100+ parts

-

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10k+ parts

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500

$0.766

-

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Component Stockers USA

USA . 4,486 parts In-Stock

1+ parts

$0.930

100+ parts

$0.750

1k+ parts

$0.710

10k+ parts

-

4,486

$0.930

$0.750

$0.710

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Microchip USA

USA . 4,832 parts In-Stock

1+ parts

$4.683

100+ parts

-

1k+ parts

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4,832

$4.683

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Perfect Parts

USA . 60,480 parts In-Stock

1+ parts

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60,480

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,369 parts In-Stock

1+ parts

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8,369

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A-Z Elektronik GmbH

Germany . 5,846 parts In-Stock

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5,846

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SupplyDigital Components

Austria . 4,511 parts In-Stock

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4,511

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Alle Elektronik GmbH

Germany . 3,897 parts In-Stock

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3,897

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GreenTree Electronics

Israel . 2,788 parts In-Stock

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2,788

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TANS Electronics

Latvia . 2,580 parts In-Stock

1+ parts

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2,580

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Problanco Electronics

Mexico . 1,866 parts In-Stock

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1,866

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Kepictronics

USA . 981 parts In-Stock

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981

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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745

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Overview

Unlock the power of reliable data storage with the CAV24C64YE-GT3 EEPROM by Onsemi. Designed with precision and quality in mind, this small outline, thin profile memory device is perfect for automotive applications. With a high endurance of 1,000,000 write/erase cycles and a wide operating temperature range, customers can trust in its durability and performance. Say goodbye to worries about data loss with the hardware write protection feature. Experience seamless integration and efficient operation with Onsemi's innovative technology. Elevate your projects with the CAV24C64YE-GT3 and enjoy peace of mind knowing your data is safe and secure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it a reliable choice.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures that the EEPROM meets automotive industry standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape makes the EEPROM compact and space-efficient, ideal for applications with limited space.

Operating Mode: SYNCHRONOUS

The synchronous operation allows for faster data transfer speeds and efficient performance.

Nominal Supply Voltage: 5V

With a standard nominal supply voltage, this EEPROM can easily be integrated into various systems without additional power requirements.

No. of Terminals: 8

The number of terminals provides multiple connection points, ensuring a secure and stable connection within the system.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact design, making it suitable for applications where space is limited.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the EEPROM to function effectively in various environments.

Organization: 64KX1

The organization of 64KX1 offers sufficient memory capacity for storing data, making it suitable for a wide range of applications.

Technical Specifications

EEPROM CAV24C64YE-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Access Time:

.0035 ns

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

5

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

CAV24C64YE-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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