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25LC256T-E/SN16KV18

Microchip Technology

25LC256T-E/SN16KV18 by Microchip Technology

25LC256T-E/SN16KV18 by Microchip is a 32KX8 EEPROM with 10 MHz clock frequency, 1000000 write/erase cycles, and SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level, -40 to 125 °C operating temperature range, and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 2,501 parts In-Stock

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Vyrian

USA . 1,025 parts In-Stock

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1,025

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Prism Electronics

USA . 33 parts In-Stock

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33

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Microchip USA

USA . 1,502 parts In-Stock

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$2.939

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$2.939

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Corohmni

South Africa . 47 parts In-Stock

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$4.968

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$4.968

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Aztec Data Supply Inc.

USA . 787 parts In-Stock

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$5.570

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787

$5.570

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Ampacity Inc.

Singapore . 1,212 parts In-Stock

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$15.000

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$15.000

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AZTECH Wire

Italy . 704 parts In-Stock

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$17.300

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$17.300

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Semicontronic

India . 1,555 parts In-Stock

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$24.000

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$23.400

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$23.280

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$24.000

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 17,989 parts In-Stock

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GreenTree Electronics

Israel . 11,593 parts In-Stock

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NIA Electronics

USA . 7,829 parts In-Stock

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LMD Electronica

Estonia . 6,880 parts In-Stock

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Continental Prestige Electronics

USA . 6,198 parts In-Stock

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Ledger Components

France . 6,064 parts In-Stock

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Argo Parts USA

USA . 4,946 parts In-Stock

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Montano Global Distributors

Canada . 4,117 parts In-Stock

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Advanced Electronics

New Zealand . 3,617 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,300 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,063 parts In-Stock

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Bastille Electronics

Australia . 53 parts In-Stock

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Overview

Unlock a world of possibilities with the 25LC256T-E/SN16KV18 by Microchip Technology. This high-quality EEPROM offers unparalleled reliability and durability, making it the perfect choice for automotive applications. With its small outline package and hardware write protection, this product ensures your data is safe and secure. Experience the convenience of synchronous operation and 3-state output characteristics, all while enjoying the peace of mind that comes from knowing your information is protected by one of the industry's leading manufacturers. Elevate your projects with the 25LC256T-E/SN16KV18 and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the EEPROM, ensuring a longer lifespan.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures stable and reliable performance for the EEPROM.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this EEPROM is suitable for automotive applications and other demanding environments.

Memory Density: 262144 bit

With a high memory density of 262144 bits, this EEPROM can store a large amount of data efficiently.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures that the data stored in the EEPROM can be reliably accessed and modified multiple times.

Serial Bus Type: SPI

The serial bus type SPI (Serial Peripheral Interface) allows for faster data transfer and communication between the EEPROM and the host controller.

Technical Specifications

EEPROM 25LC256T-E/SN16KV18 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

2.5

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

25LC256T-E/SN16KV18 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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