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25LC256T-I/SNRVB

Microchip Technology

25LC256T-I/SNRVB by Microchip Technology

25LC256T-I/SNRVB by Microchip Technology is a serial EEPROM with 32KX8 organization, operating at up to 10 MHz. It features hardware write protection and offers endurance of 1M Write/Erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 2,968 parts In-Stock

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2,968

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Vyrian

USA . 1,318 parts In-Stock

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1,318

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.071

100+ parts

$1.968

1k+ parts

$1.968

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2,500

$2.071

$1.968

$1.968

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Corohmni

South Africa . 1,165 parts In-Stock

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$3.260

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$3.260

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Aztec Data Supply Inc.

USA . 389 parts In-Stock

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$4.940

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389

$4.940

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Ampacity Inc.

Singapore . 1,111 parts In-Stock

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$8.000

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1,111

$8.000

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Semicontronic

India . 225 parts In-Stock

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$10.000

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$9.750

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$9.700

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225

$10.000

$9.750

$9.700

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AZTECH Wire

Italy . 268 parts In-Stock

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$17.476

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268

$17.476

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Marpe Global Electronics

Taiwan . 4,220 parts In-Stock

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QualityLine Systems

Poland . 4,220 parts In-Stock

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XL Components Corporation

Australia . 4,220 parts In-Stock

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Argo Parts USA

USA . 3,923 parts In-Stock

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Continental Prestige Electronics

USA . 918 parts In-Stock

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Modulus Dynamics

Lithuania . 550 parts In-Stock

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550

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$0.155

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$0.155

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$0.155

500

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$0.155

$0.155

$0.155

Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock endless possibilities with the Microchip Technology 25LC256T-I/SNRVB EEPROM. Known for their top-notch quality and reliability, Microchip Technology brings you a small outline package with a maximum clock frequency of 10 MHz and industrial temperature grade for optimal performance. Perfect for applications requiring data storage and retrieval, this EEPROM offers 1000000 write/erase cycles and a wide operating voltage range. Elevate your projects with seamless integration, durability, and unmatched value that only Microchip Technology can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the EEPROM, making it a reliable choice for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a standard voltage, ensuring compatibility with various systems and devices.

Memory Density: 262144 bit

Offers a high memory density, allowing for storage of a large amount of data in a compact form factor.

Endurance: 1000000 Write/Erase Cycles

Withstands a high number of write/erase cycles, ensuring reliability and longevity for data storage and retrieval.

Serial Bus Type: SPI

Supports the widely used SPI serial bus interface for efficient communication with other devices, enhancing compatibility and ease of integration.

Technical Specifications

EEPROM 25LC256T-I/SNRVB attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

4.5

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

25LC256T-I/SNRVB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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