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24LC128-I/SNRVF

Microchip Technology

24LC128-I/SNRVF by Microchip Technology

24LC128-I/SNRVF by Microchip Technology is an EEPROM with 16KX8 organization, operating at 5V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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VNN

France . 1,436 parts In-Stock

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Vyrian

USA . 450 parts In-Stock

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450

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Nova Conductors

Japan . 76 parts In-Stock

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Corohmni

South Africa . 1 parts In-Stock

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$4.114

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Aztec Data Supply Inc.

USA . 4,680 parts In-Stock

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$4.140

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$4.917

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$4.671

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$4.671

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$4.917

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AZTECH Wire

Italy . 757 parts In-Stock

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$6.155

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Semicontronic

India . 890 parts In-Stock

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$16.000

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$15.600

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$15.520

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890

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$26.000

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NIA Electronics

USA . 7,891 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,449 parts In-Stock

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Montano Global Distributors

Canada . 3,640 parts In-Stock

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Continental Prestige Electronics

USA . 1,935 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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LMD Electronica

Estonia . 735 parts In-Stock

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Argo Parts USA

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Ledger Components

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Bastille Electronics

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Overview

Unlock endless possibilities with the 24LC128-I/SNRVF EEPROM by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-notch quality and reliability. This versatile EEPROM is perfect for a wide range of applications, offering seamless integration and durable performance. Experience the value and benefits of this product as it provides unmatched data storage capacity, high endurance, and efficient operation. Upgrade your projects with the 24LC128-I/SNRVF and elevate your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this EEPROM lightweight and durable, perfect for various applications.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and ensuring stability.

Screening Level: AEC-Q100

With AEC-Q100 screening, this EEPROM is designed to meet automotive industry standards for reliability and performance in harsh environments.

Package Shape: RECTANGULAR

The rectangular package shape makes this EEPROM easy to handle and integrate into existing electronic systems.

Operating Mode: SYNCHRONOUS

The synchronous operation of this EEPROM ensures precise and efficient data transfer, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for the EEPROM to operate effectively in a wide range of applications.

No. of Terminals: 8

With 8 terminals, this EEPROM allows for flexible connectivity and integration within electronic circuits with ease.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and provides a compact solution for applications with limited board space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this EEPROM can withstand challenging thermal conditions without compromising performance.

Organization: 16KX8

The 16KX8 organization structure offers a balanced combination of storage capacity and data processing efficiency for various applications.

Technical Specifications

EEPROM 24LC128-I/SNRVF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

2.5

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC128-I/SNRVF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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