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25LC640-I/SNG

Microchip Technology

25LC640-I/SNG by Microchip Technology

25LC640-I/SNG by Microchip Technology is an 8KX8 EEPROM with SPI interface, operating at 2 MHz. It has a memory density of 65536 bit and can endure 100000 Write/Erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,751 parts In-Stock

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8,751

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VNN

France . 327 parts In-Stock

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327

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Nova Conductors

Japan . 39 parts In-Stock

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39

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$2.753

100+ parts

$2.616

1k+ parts

$2.616

10k+ parts

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600

$2.753

$2.616

$2.616

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Aztec Data Supply Inc.

USA . 4,129 parts In-Stock

1+ parts

$3.280

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-

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4,129

$3.280

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Corohmni

South Africa . 234 parts In-Stock

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$4.339

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234

$4.339

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Ampacity Inc.

Singapore . 878 parts In-Stock

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$6.000

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878

$6.000

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Semicontronic

India . 628 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

628

$13.000

$12.675

$12.610

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$15.800

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456

$15.800

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Continental Prestige Electronics

USA . 5,806 parts In-Stock

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5,806

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Argo Parts USA

USA . 3,913 parts In-Stock

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3,913

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Microchip USA

USA . 493 parts In-Stock

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493

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Fulton Briggs Corp.

USA . 343 parts In-Stock

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343

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock a world of possibilities with the 25LC640-I/SNG by Microchip Technology. This high-quality EEPROM offers reliable data storage in a compact package, perfect for industrial applications. With 100,000 write/erase cycles and a wide operating temperature range, this EEPROM ensures your data is safe and accessible when you need it most. Trust Microchip Technology to deliver cutting-edge solutions that bring value and peace of mind to your projects. Experience the difference with the 25LC640-I/SNG.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the EEPROM.

Surface Mount:

YES - Allows for easy installation on circuit boards, saving time and effort.

Package Shape:

RECTANGULAR - Provides a compact design for space-saving in electronic devices.

Operating Mode:

SYNCHRONOUS - Enables efficient and synchronized data transfer within the EEPROM.

Nominal Supply Voltage / Vsup (V):

5 - Ensures stable and reliable power supply for optimal performance.

Power Supplies (V):

3/5 - Offers flexibility in power options for various applications.

No. of Terminals:

8 - Provides multiple connection points for secure integration.

Package Style (Meter):

SMALL OUTLINE - Ideal for applications requiring a compact form factor.

Maximum Operating Temperature:

85 °C - Allows for reliable operation in harsh environmental conditions.

Organization:

8KX8 - Organized in a format that is easy to manage and access data.

Minimum Operating Temperature:

40 °C - Can function in extreme cold temperatures without performance issues.

Terminal Finish:

Matte Tin (Sn) - Provides a corrosion-resistant finish for long-lasting durability.

Terminal Position:

DUAL - Offers flexibility in connection options for varied system configurations.

Write Protection:

HARDWARE/SOFTWARE - Ensures data security and prevents accidental data corruption.

Maximum Seated Height:

1.75 mm - Low profile design for space-constrained applications.

Maximum Clock Frequency (fCLK):

2 MHz - Supports high-speed data transfer for efficient performance.

Width:

3.9 mm - Compact width for easy placement in tight spaces.

Minimum Supply Voltage (Vsup):

2.5 V - Allows for operation in low-power applications.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes during assembly.

Length:

4.9 mm - Compact length for space-saving integration in electronic systems.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with extended temperature ranges.

Technology:

CMOS - Utilizes advanced CMOS technology for energy-efficient operation.

Parallel or Serial:

SERIAL - Compatible with serial communication protocols for seamless integration.

Terminal Form:

GULL WING - Provides secure solder connections for reliable performance.

Maximum Supply Current:

5 mA - Low power consumption for energy-efficient operation.

No. of Words:

8192 words - Offers ample storage capacity for data storage needs.

Memory Width:

8 - Provides a standard memory width for compatibility with various systems.

Minimum Data Retention Time:

200 - Ensures data integrity even during power loss situations.

Terminal Pitch:

1.27 mm - Allows for precise alignment and secure connection with other components.

No. of Words Code:

8K - Indicates the memory capacity for easy identification.

Maximum Supply Voltage (Vsup):

5.5 V - Safe operating voltage range for reliable performance.

Endurance:

100000 Write/Erase Cycles - Allows for frequent read/write operations without degradation.

Serial Bus Type:

SPI - Supports Serial Peripheral Interface for seamless data exchange.

Maximum Write Cycle Time (tWC):

5 ms - Quick write cycle time for efficient data processing.

Memory Density:

65536 bit - High memory density for storing large amounts of data.

Memory IC Type:

EEPROM - Specifically designed for non-volatile data storage applications.

Maximum Standby Current:

0.000001 Amp - Ultra-low standby current for power-efficient operation.

Technical Specifications

EEPROM 25LC640-I/SNG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

200

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC640-I/SNG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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