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25LC256-I/PG

Microchip Technology

25LC256-I/PG by Microchip Technology

25LC256-I/PG by Microchip: 32KX8 EEPROM with SPI interface, 10 MHz clock frequency, and 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 1,000 parts In-Stock

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Vyrian

USA . 445 parts In-Stock

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Nova Conductors

Japan . 62 parts In-Stock

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Corohmni

South Africa . 782 parts In-Stock

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$3.799

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$3.799

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Aztec Data Supply Inc.

USA . 1,377 parts In-Stock

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$4.360

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$4.360

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AZTECH Wire

Italy . 608 parts In-Stock

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$16.387

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Ampacity Inc.

Singapore . 583 parts In-Stock

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$17.000

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Semicontronic

India . 1,240 parts In-Stock

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$26.000

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$25.350

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$25.220

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$26.000

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Argo Parts USA

USA . 4,002 parts In-Stock

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West Coast Incorporated

USA . 3,631 parts In-Stock

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Continental Prestige Electronics

USA . 1,641 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Enhance your projects with the reliable 25LC256-I/PG EEPROM by Microchip Technology. Known for their high-quality components, Microchip Technology delivers top-notch products that guarantee superior performance and durability. This EEPROM is perfect for a wide range of applications, offering customers unmatched value, benefits, and advantages. Whether you're working on industrial automation, automotive systems, or consumer electronics, the 25LC256-I/PG provides the memory capacity and reliability you need to bring your ideas to life. Trust Microchip Technology to elevate your designs with premium components that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environments.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage ensures stable operation and performance of the EEPROM.

Maximum Operating Temperature: 85 °C

Capability to operate at a high temperature range allows for versatile use in different applications.

Write Protection: HARDWARE/SOFTWARE

Offering both hardware and software write protection ensures data security and prevents accidental data changes.

Memory Density: 262144 bit

High memory density allows for storing a large amount of data in a compact EEPROM package.

Technical Specifications

EEPROM 25LC256-I/PG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.46 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

25LC256-I/PG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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